Power module package and method for manufacturing the same
Inactive Publication Date: 2013-01-24
SAMSUNG ELECTRO MECHANICS CO LTD
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Benefits of technology
The present invention provides a power module package and a method for manufacturing the same with improved heat radiation characteristics. The power module package includes first and second lead frames with ceramic coating layers formed on a portion of their surfaces. The ceramic coating layers may be formed using a sol-gel method. The semiconductor devices are mounted on the ceramic coated lead frames. A thermal diffusion layer made of metal material may be formed on the lower surface of the ceramic coating layer. The power module package may also include a wire electrically connecting the semiconductor devices or between them and the lead frames, and a molding formed on the lead frames. The method for manufacturing the power module package includes preparing the lead frames, forming the ceramic coating layers on the lead frames, mounting the semiconductor devices on the ceramic coated lead frames, and optionally forming a thermal diffusion layer and a wire. The molding may be formed to cover the semiconductor devices and the lead frames. The invention provides improved heat dissipation and better control of heat distribution in the power module package.
Problems solved by technology
As a result, a solution for a problem of heat generation from electronic parts has emerged as an important issue.
In particular, when using a high-capacity power device (for example, a high-capacity insulated gate bipolar transistor (IGBT), or the like), heat generated from a high heat generation power device affects a control device that is relatively vulnerable to heat, thereby degrading the entire performance of a module and long-term reliability.
Method used
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[0034]Various objects, and advantages of the invention will become apparent from the following description of embodiments with reference to the accompanying drawings.
[0035]The terms and words used in the present specification and claims should not be interpreted as being limited to typical meanings or dictionary definitions, but should be interpreted as having meanings and concepts relevant to the technical scope of the present invention based on the rule according to which an inventor can appropriately define the concept of the term to describe most appropriately the best method he or she knows for carrying out the invention.
[0036]The above and other objects, features and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. In the specification, in adding reference numerals to components throughout the drawings, it is to be noted that like reference numerals designate like co...
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Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.
Description
CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Korean Patent Application No. 10-2011-0072105, filed on Jul. 20, 2011, entitled “Power Module Package and Method for Manufacturing the Same”, which is hereby incorporated by reference in its entirety into this application.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]The present invention relates to a power module package and a method for manufacturing the same.[0004]2. Description of the Related Art[0005]With the increase in energy consumption around the world, an efficient use of restricted energy has been attracting much attention. Therefore, a use of an inverter adopting an intelligent power module (IPM) for efficiently converting energy in the existing home and industrial appliances has accelerated.[0006]With the increase in the use of the power module, a demand in a market for high-integration, high-capacity, and small-sized products has increased. As a result, a solution for a proble...
Claims
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Login to View More IPC IPC(8): H01L23/495H01L21/56
CPCH01L23/4334H01L2924/13055H01L23/49575H01L23/49586H01L2224/32245H01L2224/48137H01L2224/48247H01L2224/73265H01L23/49537H01L21/565H01L2924/1305H01L21/50H01L23/24H01L23/3107H01L2924/00012H01L2924/00H01L24/73H01L2924/181H01L25/16H01L23/48H01L25/072
InventorKIM, KWANG SOOLEE, YOUNG KICHOI, SEOG MOONSON, JIN SUK
OwnerSAMSUNG ELECTRO MECHANICS CO LTD