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Battery module and its adhesive strap

a battery module and adhesive strap technology, applied in the direction of cell components, cell components, jackets/case materials, etc., can solve the problems of poor bonding effect and lack of good bonding effect, and achieve the effect of ensuring bonding strength

Inactive Publication Date: 2013-06-13
GETAC TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent describes a method to make a battery shell for an electronic device. The method involves using a metal substrate and a metal implanting component with a bonding part, to create a secure bond between them. Then, a plastic component is inserted into the metal substrate using a process called insert molding. The plastic component covers the metal implanting component, ensuring a strong bond. The technical effect is to create a durable battery shell for electronic devices.

Problems solved by technology

However, the material of the metal substrate and that of the plastic component are different, so the bonding effect is poor.
However, when the bonding area between the metal substrate and the plastic component is too small, the above-mentioned method may not provide a good bonding effect.

Method used

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  • Battery module and its adhesive strap
  • Battery module and its adhesive strap
  • Battery module and its adhesive strap

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Experimental program
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Embodiment Construction

[0014]The detailed features and advantages of the disclosure are described below in great detail through the following embodiments, the content of the detailed description is sufficient for those skilled in the art to understand the technical content of the disclosure and to implement the disclosure accordingly. Based upon the content of the specification, the claims, and the drawings, those skilled in the art can easily understand the relevant objectives and advantages of the disclosure.

[0015]Please refer to FIG. 1 to FIG. 4. FIG. 1 is a schematic view of an electronic device according to the first embodiment, FIG. 2 to FIG. 4 are manufacturing process views (No. 1 to No. 3) for manufacturing a battery shell of an electronic device according to an embodiment.

[0016]An embodiment discloses a method for manufacturing a battery shell applicable to an electronic device is to manufacture a battery shell structure of an electronic device. The method comprises:

[0017]First, provide a metal ...

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Abstract

The disclosure discloses a method for manufacturing a battery shell applicable to an electronic device. The method includes providing a metal substrate, a metal implanting component including a connecting part disposed thereon; bonding the metal implanting component to the metal substrate; and forming a plastic component on the metal substrate by an insert molding process. The plastic component covers the metal implanting component. By bonding the plastic component to the bonding part of the metal implanting component, the bonding strength is enforced.

Description

BACKGROUND[0001]1. Technical Field[0002]The disclosure relates to a method for manufacturing a battery shell applicable to an electronic device, and in particular, to a method for bonding a plastic component to a metal component by an insert molding process.[0003]2. Related Art[0004]The traditional insert molding process is to form a plastic component on a metal substrate by injection molding. However, the material of the metal substrate and that of the plastic component are different, so the bonding effect is poor. In order to solve the above-mentioned problem, a rough structure (i.e. a convex portion or a groove) is formed on the surface where the metal substrate is bonded to the plastic component to increase the bonding strength between the metal substrate and the plastic component.[0005]The above-mentioned method may increase the bonding effect between the metal substrate and the plastic component. However, when the bonding area between the metal substrate and the plastic compon...

Claims

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Application Information

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IPC IPC(8): H01M2/02H01M50/119
CPCH01M2/0257Y02E60/10H01M50/119H01M10/052
Inventor CHAO, PO-TSUN
Owner GETAC TECH CORP