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Serial plating system

Inactive Publication Date: 2014-03-27
ALMEX PE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention is a serial plating system that can efficiently increase the current density to the workpiece without interfering with the nozzle and the anode. It prevents the plating solution from escaping the space between the workpiece and the anode, which could cause a negative-pressure area around the nozzle and attract the workpiece towards it. This system improves the quality and speed of plating.

Problems solved by technology

However, since the nozzle is disposed between the workpiece and the electrode (anode plate) in JP-A-2006-214006 and JP-A-58-6998, a reduction in distance between the workpiece and the electrode (anode plate) is limited.
If the electrode (anode plate) is disposed close to the workpiece, an interference between the nozzle and the anode plate is caused, or flowability of the plating solution becomes worse due to narrow clearance between the nozzle and the anode plate.

Method used

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  • Serial plating system
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Embodiment Construction

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[0049]Exemplary embodiments of the invention are described in detail below. Note that the following exemplary embodiments do not in any way limit the scope of the invention defined by the claims laid out herein. Note that all of the elements described in connection with the following exemplary embodiments should not necessarily be taken as essential elements of the invention.

1. Overall Configuration

[0050]FIG. 1 is a cross-sectional view illustrating a serial plating system according to one embodiment of the invention, and FIG. 2 is a plan view illustrating the serial plating system. As illustrated in FIG. 1, a plating tank 10 is configured so that a workpiece 1 that is suspended from (held by) a transfer jig 20 is immersed in a plating solution 2 to plate the workpiece 1. The plating tank 10 has a peripheral wall 10A and a bottom wall 10B, and holds the plating solution 2 up to a liquid level L.

[0051]The workpiece 1 is a circuit board, a flexible circuit board, or the like, and eac...

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PUM

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Abstract

A serial plating system includes a plurality of nozzles that are disposed in a plating tank at a position opposite to a plurality of workpieces, and that discharge a plating solution toward the plurality of workpieces, and a plurality of anodes that are disposed in the plating tank at a position opposite to the plurality of workpieces that are serially transferred in the plating tank, one nozzle among the plurality of nozzles and at least one anode among the plurality of anodes being alternately and repeatedly disposed along a transfer direction in which the plurality of workpieces are serially transferred. The plurality of nozzles and the plurality of anodes may be disposed to overlap in a side view along the transfer direction.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims priority from Japanese Patent Application No. 2011-214302, filed on Sep. 29, 2011, the entirety of which is incorporated herein by reference.BACKGROUND[0002]1. Field of the Invention[0003]The present invention relates to a serial plating system.[0004]2. Description of the Related Art[0005]A serial plating system is configured so that an electric field is formed between a workpiece (cathode) that is suspended from (held by) a transfer jig and serially transferred in a plating tank, and an electrode (anode) disposed in the plating tank to plate the plating target surface of the workpiece.[0006]A nozzle that discharges a plating solution to the workpiece may be provided between the workpiece and the electrode (anode plate) (see JP-A-2000-178784, JP-A-2006-214006, and JP-A-58-6998). In this case, a space having a dimension equal to or larger than the diameter of the nozzle must be provided between the workpiece and the ...

Claims

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Application Information

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IPC IPC(8): C25D17/28
CPCC25D17/12C25D5/022C25D5/08C25D17/06C25D21/10
Inventor USUDA, HITOSHINODA, TOMOHIRO
Owner ALMEX PE INC