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Apparatus for processing substrate and method of cleaning same

a technology for processing apparatus and substrate, which is applied in the direction of cleaning process and apparatus, cleaning using liquids, chemistry apparatus and processes, etc., can solve problems such as substrate to be processed later on

Inactive Publication Date: 2015-03-05
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a substrate processing apparatus and a method of cleaning the same that can clean a spin head and a container. The apparatus includes a spin head, a container, and an upper nozzle member supplying a processing solution downwards. There is also a bottom cleaning member located to be a certain distance from the bottom of the spin head, where a cleaning solution is sprayed to the bottom of the spin head. The bottom cleaning member may include a support arm and a cleaning nozzle. The spin head may also have a body with a chuck pin, and the method may include spraying a cleaning solution to the bottom of the spin head while the substrate is placed on the spin head or when the spin head rotates. The method may also include spraying a rinse solution to the top of the spin head or to a location deviating from the central part of the spin head.

Problems solved by technology

Such a remaining processing solution and the by-product cause the defects of the substrate to be processed later.

Method used

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  • Apparatus for processing substrate and method of cleaning same
  • Apparatus for processing substrate and method of cleaning same
  • Apparatus for processing substrate and method of cleaning same

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Embodiment Construction

[0031]Embodiments of the present invention are described below in more detail with reference to the accompanying drawings. The embodiments of the present invention may be implemented in many forms, and it should not be construed that the scope of the present invention is limited to the following embodiments. The embodiments are provided to more fully explain the present invention to a person skilled in the art. Thus, the shapes of elements in the drawings are exaggerated to emphasize a more clear description.

[0032]FIG. 1 is a plane view of a substrate processing apparatus according to an embodiment of the present invention.

[0033]Referring to FIG. 1, a substrate processing apparatus 1 includes a fluid supply unit 10, a container 20, an elevating unit, and a spin head 40.

[0034]The fluid supply unit 10 supplies a processing solution or gas for substrate processing to a substrate W. The spin head 40 supports and rotates the substrate W when a process is performed. The container 20 preve...

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PUM

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Abstract

Provided is an apparatus for processing a substrate including a spin head on which a substrate is placed, a container provided to surround the spin head, an upper nozzle member supplying a processing solution downwards, a bottom cleaning member located to be a certain distance from the bottom of the spin head, wherein the bottom cleaning member sprays a cleaning solution to the bottom of the spin head.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This U.S. non-provisional patent application claims priority under 35 U.S.C. §119 of Korean Patent Application Nos. 10-2013-0104070, filed on Aug. 30, 2013, and 10-2013-0165407, filed on Dec. 27, 2013, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]The present invention disclosed herein relates to a substrate processing device and a method of cleaning the same.[0003]Semiconductor processes include processes of etching or cleaning a thin film, a foreign material, or a particle on a wafer. These processes are performed in such a manner that a wafer is placed on a spin head, a patterned side up, the spin head is rotated at a high speed, and thus a processing solution is supplied onto the wafer. The processing solution used for processing a substrate may remain in a component such as a spin head, even after the processing of the substrate is completed. Also, a by-product due to the chemical ...

Claims

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Application Information

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IPC IPC(8): B08B3/02
CPCB08B3/024H01L21/67051H01L21/02041B08B3/02H01L21/02057
Inventor YU, JINTACKLEE, JAE-MYOUNG
Owner SEMES CO LTD