Bending die having surface microstructures and bending punch thereof

Abstract

Provided are a bending die having surface microstructures and a bending punch thereof applicable to stamping processing to bend a blank to form a shape. The bending die includes a lower die, an upper die, and a workpiece placing piece. The lower die includes a die, and the die includes a forming surface. The upper die includes a bending punch, the bending punch stamps a blank placed on the die in a back and forth stroke, and the bending punch includes a working portion coming into contact with the blank during stamping. The workpiece placing piece is disposed between the upper die and the lower die and used to position or / and press the blank placed on the die. A plurality of microstructures are disposed on the forming surface and / or on the surface of the working portion.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of China Patent Application No. 201310457253.7, filed on Sep. 30, 2013, which is hereby incorporated by reference for all purposes as if fully set forth hereinBACKGROUND OF THE INVENTION[0002]1. Field of Invention[0003]The present invention relates to a bending die having surface microstructures and a bending punch thereof, and more particularly to a bending die in which microstructures are disposed on a surface of a working portion of a bending punch and on a forming surface of a die and a bending punch thereof.[0004]2. Related Art[0005]In the recent decade, with the rapid development of the electronics industry, the sales of commodities like consumer electronic products such as mobile phones and notebook computers increase significantly. These commodities tend to become small in volume, light in weight, high in strength, and high in heat dissipation performance in recent years, which require that the c...

AI Technical Summary

Benefits of technology

The patent is about a new bending die and punch used for stamping and bending sheet metal. The surface of the die and punch have microstructures that reduce the amount of springback (a spring-like rebound) in the sheet metal after bending. This happens because the microstructures reduce the force of friction between the sheet metal and the bending die, allowing for more complete deformation of the sheet metal and reducing uneven stress distribution. The result is a more precise and accurate bended sheet metal blank.

Problems solved by technology

However, component production adopting semiconductor or unconventional processes is subject to disadvantages such as high equipment cost, limited materials used in processes, small depth-to-width ratios of products, and difficulties in making components of 3D shapes.

After the bending dies 10, 10′, and 10″ are performed bending and stamping processing on a blank, without causing a crack on the bending corner of the blanks 11, 11′, and 11″, after the blanks 11, 11′, and 11″ are removed from the bending dies 10, 10′, and 10″, a deformation phenomenon of springback inevitably occurs to the bending, causing a change in the size of the finished product and in consequence unable to meet the standards.

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