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Method of forming metallic pattern on polymer substrate

a technology of polymer substrate and metallic pattern, applied in the field of process, can solve the problems of high production cost, and achieve the effect of reducing production cost and high quality

Active Publication Date: 2015-12-31
WISTRON NEWEB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is about a way to make high-quality metallic patterns on a polymer surface that will cost less to produce.

Problems solved by technology

However, special LDS materials and specialized instruments required for the LDS technology lead to high production costs.

Method used

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  • Method of forming metallic pattern on polymer substrate
  • Method of forming metallic pattern on polymer substrate
  • Method of forming metallic pattern on polymer substrate

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Embodiment Construction

[0019]Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts. In the following embodiment, a circuit trace part of a portable device is described as an example for illustration. It is not intended to limit the method or the part structure by the exemplary embodiments described herein.

[0020]FIGS. 1-5 schematically illustrate a method of forming a metallic pattern on a polymer substrate according to an embodiment of the present invention. Referring to FIG. 1, a polymer substrate 110 is provided. The polymer substrate 110 may be a polymer film, a casing body or even a circuit board, and may be made of a polymer material by injection molding technology. The polymer material may be nylons, polycarbonates (PC), acrylonitrile butadiene styrene (ABS), PC / ABS, polyethy...

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PUM

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Abstract

A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention generally relates to a process, in particular, to a method of forming a metallic pattern on a polymer substrate.[0003]2. Description of Related Art[0004]As technology advances, portable electronic devices, such as smart phones, tablet PCs, notebook PCs, etc., becomes more compact and lighter for easy carrying. For the purpose of miniaturization, the portable electronic device may be incorporated complicated circuitry as well as antenna formed by the LDS (laser direct structuring) technology, for compactness and efficiency. However, special LDS materials and specialized instruments required for the LDS technology lead to high production costs.SUMMARY OF THE INVENTION[0005]Accordingly, the present invention is directed to a manufacturing method of a metallic pattern over a polymer substrate, which offers high quality products with lower production costs.[0006]The present invention provides a method o...

Claims

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Application Information

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IPC IPC(8): C25D5/34H05K3/10H05K3/24C25D5/02
CPCC25D5/02H05K3/105C25D5/56H05K2201/0257H05K2203/107H05K3/24
Inventor RADI, BABAKCHEN, SHIH-HONGKUO, YU-FUCHUANG, TZU-WEN
Owner WISTRON NEWEB