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Structure with inductor and MIM capacitor

Active Publication Date: 2016-06-09
MARLIN SEMICON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The objective of this patent is to provide a way to make both capacitors and inductors in a single process.

Problems solved by technology

This is particularly true where complex electronic circuitry is to be used for telecommunications and multimedia purposes.

Method used

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  • Structure with inductor and MIM capacitor
  • Structure with inductor and MIM capacitor
  • Structure with inductor and MIM capacitor

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Embodiment Construction

[0013]FIG. 1 to FIG. 7 are schematic drawings illustrating a method for fabricating a structure including an inductor and an MIM capacitor according to a first preferred embodiment of the present invention. FIG. 14 is a schematic drawing illustrating a top view of an inductor region shown in FIG. 7.

[0014]As shown in FIG. 1, a dielectric layer 10 is provided. The dielectric layer 10 is divided into a capacitor region A and an inductor region B. Before forming the dielectric 10, a metal layer 12 can be formed to make the dielectric layer 10 cover and be disposed on the metal layer 12. According to a preferred embodiment of the present invention, a transistor 14 may be formed below the metal layer 12 before the metal layer 12 is formed. That is, the fabricating method of the present invention is preferably performed after the transistor 14 is completed. The present invention is not limited to this sequence, however. According to another preferred embodiment, the fabricating method of t...

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PUM

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Abstract

A structure with an inductor and a MIM capacitor is provided. The structure includes a dielectric layer, an inductor and a MIM capacitor. The inductor and the MIM capacitor are disposed within the dielectric layer. The inductor includes a core and a wire surrounding the core. The MIM capacitor includes a top electrode, a bottom electrode and an insulating layer. The top electrode or the bottom electrode includes a material which forms the core.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a structure with an inductor and a metal-insulator-metal (MIM) capacitor and a method of fabricating the same, and more particularly relates to a method and a structure of using the same material to form the core of the inductor and the bottom electrode of the MIM capacitor.[0003]2. Description of the Prior Art[0004]Due to increased complexities in modern day electronic devices, miniaturization has become increasingly important. This is particularly true where complex electronic circuitry is to be used for telecommunications and multimedia purposes.[0005]Telecommunications and multimedia require RF devices, in which capacitors and inductors are often used, and frequently appear either in integrated form or as individual components.[0006]A novel method which can combine the fabricating steps of capacitors and inductors is needed so as to reduce fabricating time and costs.SUMMARY OF THE IN...

Claims

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Application Information

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IPC IPC(8): H01L27/06H01L49/02
CPCH01L27/0629H01L28/60H01L28/10H01L28/87H01L28/91
Inventor ZHOU, ZHIBIAOWU, SHAO-HUIKU, CHI-FA
Owner MARLIN SEMICON LTD