Package with backside protective layer during molding to prevent mold flashing failure

Abstract

A semiconductor package formed utilizing a removable backside protective layer includes a leadframe, a die pad, leads and a molding compound around them. The first surface of the die pad and leads are exposed to an external environment by the plurality of recesses. The recesses are formed by coupling a removable backside protective layer to the leadframe before applying the molding compound. After the molding compound is applied and cured, the backside protective layer is removed to expose the first surface of the die pad and the first surfaces of the leads so the semiconductor package may be mounted within an electronic device. The removable backside protective layer protects the die pad and the leads from mold flashing and residue when forming the semiconductor package during the fabrication process.

Description

BACKGROUNDTechnical Field[0001]The present disclosure is directed to a package having a removable protective layer attached to the leadframe during molding to prevent mold flashing from forming on the leads.Description of the Related Art[0002]As consumer demand increases for semiconductor packages, manufacturers face significant challenges to manufacture and form packages by the thousands with zero to minimal defects. Additionally, as semiconductor packages are mounted within an electronic device, manufacturers face significant challenges to avoid mounting defects that may cause short circuiting of semiconductor packages, effectively reducing their life span or making them defective. Semiconductor packages often include a die, a leadframe, and a molding compound. For example, the leadframe is mounted to a leadframe tape. The die is mounted to a die pad of the leadframe coupled to the leadframe tape, and electrical connections are formed to couple the die to leads of the leadframe. T...

AI Technical Summary

Benefits of technology

This solution reduces manufacturing defects, increases the viability of semiconductor packages, and decreases manufacturing costs by preventing mold flashing and solder-related issues, ensuring reliable and efficient package formation.

Problems solved by technology

As consumer demand increases for semiconductor packages, manufacturers face significant challenges to manufacture and form packages by the thousands with zero to minimal defects.

Additionally, as semiconductor packages are mounted within an electronic device, manufacturers face significant challenges to avoid mounting defects that may cause short circuiting of semiconductor packages, effectively reducing their life span or making them defective.

Unfortunately, when utilizing the above formation technique, molding compound may cover the leads and the die pad of the leadframe if debris gets under the leadframe tape when forming the molding compound.

This coverage reduces the effectiveness of semiconductor packages when utilized in an electronic device or makes semiconductor packages unusable or defective.

Other difficulties exist as well.

First, when applying solder balls to mount a semiconductor package within an electronic device, if solder balls are placed incorrectly, solder balls may touch multiple electrical connections and short circuit the semiconductor package in an electronic device.

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