Polishing tools and methods of polishing substrates

Inactive Publication Date: 2018-12-27
CORNING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent describes a polishing tool that is used to polish the edges of glass substrates using a CNC machine. The tool is made with a polishing material that includes phenolic resin, zinc oxide, magnesium oxide, a cooling agent, and an abrasive. The method involves preparing the glass substrate, attaching the polishing tool to the machine, and using the machine to polish the edges of the substrate. The technical effects of the patent include improved polishing efficiency and quality, as well as a simplified and streamlined production process.

Problems solved by technology

As such, the glass used for these touch interfaces is now very thin.
Additionally, acid etching processes may require expensive surface protection film and additional safety measures.
Brush polishing also presents challenges.
For example, polishing tool variance makes it difficult to mass-produce consistent glass edges.
Furthermore, brush polishing may take up to 3.5 hours to polish an edge of a glass substrate.
The brush polishing process itself also has limitations.
While brush polishing may be performed using CNC machines, the polishing tools experience fast and excessive wear as they polish an edge of a glass substrate.
As such, there may be uneven processing of the glass edge and the glass may experience edge burning where the tool is forced back in contact with the glass edge.

Method used

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  • Polishing tools and methods of polishing substrates
  • Polishing tools and methods of polishing substrates
  • Polishing tools and methods of polishing substrates

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Embodiment Construction

[0016]Embodiments of the present disclosure are directed to polishing tools and methods of polishing glass substrates. Referring generally to the figures, embodiments of polishing tools and methods of polishing glass substrates provided herein allow for the reduction of chips and subsurface damage on an edge of a glass substrate. The reduction of chips and subsurface damage on an edge of a glass substrate increases the edge strength of the glass substrate and thus provides an overall better quality glass substrate to be used in various practical applications. Furthermore, the methods utilized herein may decrease instances where the glass substrate experiences edge burn during edge polishing processes. The various polishing tools and methods of polishing glass substrates are described in more detail herein with specific reference to the corresponding figures.

[0017]Some embodiments disclosed herein are directed to polishing tools having a stem and a polishing material. In these embodi...

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Abstract

Polishing tools and methods of polishing a glass substrate are disclosed. A polishing tool (200) includes a stem (220) and a polishing material (210) bonded to the stem (220). The polishing material (210) includes, in volume concentration, about 18% to about 42% phenolic resin, about 18% to about 30% zinc oxide, about 1% to about 10% magnesium oxide, a cooling agent, and an abrasive.

Description

BACKGROUNDField[0001]The present disclosure is directed to polishing tools and methods of making and using the same. In particular, the disclosure is directed hard and high efficiency polishing tools to be used in conjunction with computer numerical control (CNC) machines.Technical Background[0002]Innovations in user interfaces incorporating touch technology have exploded over the last few years. Recent innovations in the field, e.g., One Glass Solution (OGS) touch technology, allow for thinner, lower cost touch panels in electronic devices while providing a brighter user interface. OGS touch technology works by reducing the number of glass layers. As such, the glass used for these touch interfaces is now very thin. Often, to create desired shape of the glass interface, the edge of the glass is ground down. During the grinding process, chips of about 20 μm to about 30 μm and subsurface damage may be caused around the edges of the glass. This damage should be removed to increase the ...

Claims

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Application Information

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IPC IPC(8): B24D3/28B24B27/00B24B9/10B24D5/06B24D3/34
CPCB24D3/28B24B27/0015B24B9/10B24D5/06B24D3/342B24D11/001B24D18/00
InventorCHUANG, CHAO-YINTANG, YUYINXIA, BAOSHAN
OwnerCORNING INC