Curing shield
a shield and shield technology, applied in the field of shields, can solve the problems of unsatisfactory “drips” onto surrounding objects, haphazard present methods of insulating joined surfaces, and difficulty or inability to apply insulation in enclosed areas, so as to improve the isolation of faying surfaces and enhance reusability.
Active Publication Date: 2020-05-07
SPIRIT AEROSYSTEMS
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- Abstract
- Description
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- Application Information
AI Technical Summary
Benefits of technology
The present invention provides better isolation of a faying surface during a curing process. The curing shield helps prevent adhesive drips and also provides insulation for sensitive components. It enhances reusability and allows for new configurations and heat application.
Problems solved by technology
Curing processes may lead to loss of the bonding substance from the joined surfaces, resulting in undesired “drips” onto surrounding objects.
However, present methods for insulating the joined surfaces are haphazard.
Insulation may be difficult or impossible to apply in enclosed areas that cannot be easily accessed because of the nature of the assembled parts.
Method used
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Embodiment Construction
[0020]The following detailed description of the invention references the accompanying drawings that illustrate specific embodiments in which the invention can be practiced. The embodiments are intended to describe aspects of the invention in sufficient detail to enable those skilled in the art to practice the invention. Other embodiments can be utilized and changes can be made without departing from the scope of the current invention. The following detailed description is, therefore, not to be taken in a limiting sense. The scope of the current invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled.
[0021]In this description, references to “one embodiment”, “an embodiment”, or “embodiments” mean that the feature or features being referred to are included in at least one embodiment of the technology. Separate references to “one embodiment”, “an embodiment”, or “embodiments” in this description do not necessarily ref...
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Abstract
A part assembly including a curing shield and a method for secondarily bonding two parts of the part assembly utilizing the curing shield. The method for secondary bonding includes fixing a base of a clip of a curing shield to a first surface of a first part. The curing shield includes a pad fixed to the clip. The clip has the base and a spine fixed to and extending away from the base and terminating at a distal end. The pad extends along at least a portion of a length of the spine between the base and the distal end. The method also includes applying adhesive along a faying surface of one of the first part and a second part. The second part is assembled to the first part along the faying surface so that the distal end of the clip extends toward the second surface and the curing shield defines a pocket adjacent the faying surface at least partly enclosed by the pad.
Description
BACKGROUND[0001]Secondarily bonding composite parts generally requires application of a bonding substance such as a paste and / or film adhesive along joined surfaces of the parts. Heat and / or pressure may be required to cure the bonding substance and ensure a tight fit between the parts. Curing processes may lead to loss of the bonding substance from the joined surfaces, resulting in undesired “drips” onto surrounding objects.[0002]Insulation may also be applied where a curing process includes the application of heat. However, present methods for insulating the joined surfaces are haphazard. Insulation may be difficult or impossible to apply in enclosed areas that cannot be easily accessed because of the nature of the assembled parts. For example, an electronics compartment may be formed by two composite parts in a manner that restricts or prohibits access to the compartment for insulation of the joined surfaces.[0003]There is therefore a need for an improved method and apparatus for...
Claims
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Patent Timeline
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IPC IPC(8): B29C65/00B32B7/12B32B3/26B29C65/48B32B27/08
CPCB32B37/00B29C66/006B32B7/12B32B3/266Y10T428/24008B32B27/08B29C65/4835B29C66/721B29C65/1412B29C65/1467B29C65/18B29C65/5057B29C66/003B29C66/112B29C66/131B29C66/24244B29C66/542B29C66/7212B29C66/73111B29L2031/3076B29L2031/3481B29K2307/04B29K2309/08
Inventor OSBORNE, GEORGE M.
Owner SPIRIT AEROSYSTEMS