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Dynamic generation of layout adaptive packaging

a technology of dynamic generation and adaptive packaging, applied in the field of adaptive packaging methods and apparatus, can solve the problems of high difficulty in accurately placing components, misalignment, and wiring placement, and achieve the effect of accurate wiring connections

Active Publication Date: 2020-05-21
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes a method for accurately attaching wiring connections to components in a microlithography system. The method involves obtaining data on the component and its connection pattern in a designed state, and then scanning the component with a scanning device to obtain new data. This new data is compared to the designed state data to determine any offset or changes in the component's position. Based on this information, the connection pattern is then modified to account for the changes in the component's position. This method helps to ensure precise and reliable wiring connections during the microlithography process.

Problems solved by technology

One of the major challenges of microlithography systems is placement of wiring between components.
Such accurate placement of components is highly problematic and misalignment can occur during processing.
The problems that this causes include components produced that are out of specification, to components that do not work altogether.
Problems of these sort impact the overall economic viability of the lithography process.

Method used

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  • Dynamic generation of layout adaptive packaging
  • Dynamic generation of layout adaptive packaging
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Examples

Experimental program
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Embodiment Construction

[0027]In the aspects described below, eye configurations, alignment mark shapes, and cell codes are representative to give an example. There might be any number of eyes and any number of steps to capture alignment mark images. The shape of an alignment mark is not limited by the cross shape. The alignment mark may be any shape. A mark cell code may be implemented by either OCR, shape changes or size changes. The mark cell code can also be embedded to mark itself by changing the thickness of lines or adding additional features to lines. The illustrated embodiments, therefore, are merely descriptive in nature and should not be considered limiting.

[0028]FIG. 1A is a perspective view of a photolithography system 100 according to embodiments disclosed herein. The system 100 includes a base frame 110, a slab 120, a stage 130, and a processing apparatus 160. The base frame 110 rests on the floor of a fabrication facility and supports the slab 120. Passive air isolators 112 are positioned b...

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PUM

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Abstract

Aspects of disclosure provide a method for attaching wiring connections to a component using both design and field measured data of the component to produce accurate wiring connections.

Description

BACKGROUNDField[0001]Embodiments of the present disclosure generally relate to apparatuses, systems and methods for processing one or more substrates, and more specifically to apparatuses, systems and methods for performing photolithography processes. More specifically, aspects of the disclosure relate to adaptive packaging methods and apparatus.Description of the Related Art[0002]Photolithography is widely used in the manufacturing of semiconductor devices and display devices, such as liquid crystal displays (LCDs). Large area substrates are often utilized in the manufacture of LCDs. LCDs, or flat panels, are commonly used for active matrix displays, such as computers, touch panel devices, personal digital assistants (PDAs), cell phones, television monitors, and the like. Generally, flat panels include a layer of liquid crystal material forming pixels sandwiched between two plates. When power from a power supply is applied across the liquid crystal material, an amount of light pass...

Claims

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Application Information

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IPC IPC(8): G03F7/20
CPCG03F7/70991G03F7/70508G03F7/70383G03F7/70291H01L21/0274G03F7/70475
Inventor HOLLERBACH, UWELAIDIG, THOMAS L.
Owner APPLIED MATERIALS INC