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Edge-lit Downlight Apparatus

a technology of downlight apparatus and edgelit, which is applied in the direction of lighting and heating apparatus, fixed installation, instruments, etc., can solve the problems of complex die-casting process, time-consuming and costly, and insufficient light emission performance, so as to avoid misalignment or gap of optical components due to assembly problems, improve heat dissipation performance, and improve the effect of heat dissipation performan

Active Publication Date: 2020-07-30
XIAMEN ECO LIGHTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]The present disclosure provides an edge-lit downlight apparatus configured with a reasonable structure, good heat dissipation effect and good light-emitting effect.
[0020](1) The circuit board provided with the light module and the surface housing are adhered by heat dissipation material (e.g., heat dissipation tape or heat dissipation gel) so as to enhance the heat dissipation performance.
[0021](2) The first brackets engage with the fasteners to increase the contact area, so that the positioning between the components may be more precise and firmer. In this way, the misalignment or gap of the optical components due to assembly issues may be avoided. It can be understood that such misalignment or gap may cause water ripple, which results in poor light-emitting effect. With the configuration proposed by the present disclosure, the optical efficiency and light quality may be greatly enhanced.

Problems solved by technology

1) Generally the surface ring of a traditional edge-lit downlight apparatus is manufactured by the die-casting process so as to ensure it passes the Temperature Rise Test. However, the die-casting process is complex, time-consuming, and costly.
2) For a traditional edge-lit downlight apparatus, only screws are used to press the laminate against the optical components. The performance of light emission is not satisfactory.
3) Conventionally, the edge-lit downlight apparatus is mounted on the ceiling via a bracket and screws. Such installation method is inefficient and requires more installation time, which leads to higher installation cost.
4) The downlight apparatus is usually not waterproof or the waterproof level is not high, which limits the scope of use. Also, there may be safety concerns in some applications.

Method used

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Examples

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Embodiment Construction

[0029]To make the objectives, technical solutions and advantages of the present invention clearer, with reference to the accompanying drawings and the following embodiments, some embodiments are described in further detail. It is to be understood that the description is not to be considered as limiting the scope of the present invention.

[0030]The present disclosure relates to the edge-lit downlight apparatus having good heat dissipation effect. Meanwhile, the first bracket and the fasteners are configured to improve the pressing effect of the laminate to the optical components, so the light-emitting effect may be enhanced.

[0031]Refer to FIGS. 1-5. In a first embodiment, the edge-lit downlight apparatus includes a surface housing 10 having a base and a side wall, a laminate 20, and a light guide module 30 located between the surface housing 10 and the laminate 20.

[0032]The surface housing 10 may be ring-shaped, and includes an L-shaped cross-section. A base of the surface housing 10 ...

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PUM

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Abstract

An edge-lit downlight apparatus includes a surface housing having a base and a side wall, a laminate, and a light guide module. The downlight apparatus includes a circuit board having an inner and an outer surface wall. The downlight apparatus includes first brackets, and each includes a body and a contacting part. The body of the first bracket abuts against the side wall of the surface housing, and the contacting part of the first bracket extends outward from the body and abuts against the laminate. The downlight apparatus includes fasteners passing through the contacting parts of the first brackets, the laminate, and being removably connected to the surface housing. LED chips are located on the inner surface wall of the circuit board.

Description

FIELD[0001]The present invention is related to a downlight apparatus, and more particularly related to an edge-lit downlight apparatus.BACKGROUND[0002]A conventional edge-lit downlight apparatus generally has the following drawbacks:[0003]1) Generally the surface ring of a traditional edge-lit downlight apparatus is manufactured by the die-casting process so as to ensure it passes the Temperature Rise Test. However, the die-casting process is complex, time-consuming, and costly.[0004]2) For a traditional edge-lit downlight apparatus, only screws are used to press the laminate against the optical components. The performance of light emission is not satisfactory.[0005]3) Conventionally, the edge-lit downlight apparatus is mounted on the ceiling via a bracket and screws. Such installation method is inefficient and requires more installation time, which leads to higher installation cost.[0006]4) The downlight apparatus is usually not waterproof or the waterproof level is not high, which...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F21V17/10F21V8/00F21V31/00
CPCG02B6/0083F21V17/10F21V31/005F21Y2115/10G02B6/0085F21S8/04F21V23/009F21V29/70F21Y2103/33G02B6/0081F21Y2105/00F21Y2103/10
Inventor HOU, SHOUQIANGDONG, YONGZHEWEN, XIAOLIANGLIU, ANYONG
Owner XIAMEN ECO LIGHTING CO LTD