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Method and system for the localized deposit of metal on a surface

a metal surface and localization technology, applied in the direction of crystal growth process, polycrystalline material growth, chemically reactive gas, etc., can solve the problem of complex patterning or overlaying procedures

Inactive Publication Date: 2021-04-22
ILLINOIS TOOL WORKS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present patent is about a system and method for depositing metal on a substrate. The system has gas outlets and a laser that work together to heat a specific area of the substrate and allow for the continuous or controlled deposition of a metal layer in a desired pattern. This technology can be used for a variety of applications such as manufacturing electronic components on silicon wafers, growing monocrystalline metal structures, and depositing metal layers in a precise pattern on different substrates.

Problems solved by technology

If less than the entirety of a substrate is to be coated, complex patterning or overlaying procedures are required.

Method used

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  • Method and system for the localized deposit of metal on a surface
  • Method and system for the localized deposit of metal on a surface
  • Method and system for the localized deposit of metal on a surface

Examples

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Embodiment Construction

[0015]Reference will now be made in detail to certain embodiment(s), examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts. Embodiments of the present disclosure are directed to a system and process for the localized deposit of a metal layer on substrate.

Systems

[0016]An embodiment of the system 10 of the present disclosure is illustrated in FIG. 1. The system shown in FIG. 1 comprises a vacuum chamber 11. The vacuum chamber 11 is configured to maintain a vacuum within the chamber. A mechanical vacuum pump is generally sufficient for most applications. In some applications, however, a high vacuum state may be desirable. A substrate 20, on which a metal layer is to be printed, is positioned within the vacuum chamber 11. As such, the vacuum chamber 11 may contain a substrate holder. If it is desirable that more than one substrate 20 is to be coated within the...

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Abstract

The present disclosure is directed to a method and system for the localized deposition of a metal layer on a surface. The method involves introducing at least two gaseous reactants to a substrate surface that is locally heated by a laser. The surface is heated to a temperature at which the gaseous reactants undergo a reaction that results in metal crystal growth on the substrate surface. The reaction is maintained for a desired period of time and under desired conditions to produce a localized deposit of a metal layer on the heated zone of the substrate. In some embodiments, the gas outlets and the laser may be moved in a controlled manner so that a metal layer may be deposited in a desired pattern on the substrate surface.

Description

BACKGROUND OF THE INVENTION[0001]The present disclosure is directed toward methods and systems for the printing of a substrate with a metal surface layer.[0002]The use of chemical vapor deposition processes for the coating of a substrate with a metal is known in the art. In a conventional chemical vapor deposition process, a substrate is heated and the reactants are introduced across that substrate, resulting in the deposition of a metal layer across the entirety of the substrate. If less than the entirety of a substrate is to be coated, complex patterning or overlaying procedures are required.[0003]The present disclosure provides improved methods and systems for the deposit of a metal surface layer. By restricting the reactants to a relatively small space and performing the reaction on a limited portion of the substrate, the methods and systems described herein provide for a localized deposit of a metal surface coating on a controlled portion of a substrate, as opposed to the less ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C23C16/455C23C16/14C23C16/04H01L21/285
CPCC23C16/455C23C16/14H01L21/28562C23C16/45514C23C16/047C23C16/483C30B25/00C30B29/02Y02P10/25
Inventor XIAO, ZHIGANG
Owner ILLINOIS TOOL WORKS INC
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