Unlock instant, AI-driven research and patent intelligence for your innovation.

Connection structure and assembly

a technology of connecting structure and assembly, applied in the direction of mechanical equipment, electrical apparatus, construction details of electrical apparatus, etc., can solve the problems of large size of the connecting structure between the first substrate and the second substra

Active Publication Date: 2021-04-29
FANUC LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

Enables miniaturization of the connection structure and assembly by eliminating the need for additional pins, improving positional accuracy and reducing size and part count.

Problems solved by technology

Thus, there is a concern that the connection structure for connecting the first substrate and the second substrate becomes large in size.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Connection structure and assembly
  • Connection structure and assembly
  • Connection structure and assembly

Examples

Experimental program
Comparison scheme
Effect test

embodiment

[0016]An assembly 10 of this embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a schematic diagram showing a configuration of the assembly 10 of the embodiment, and FIG. 2 is an exploded perspective view of the assembly 10 of FIG. 1. The assembly 10 includes a printed board 12, an installation object 14, and a plurality of connection structures 16.

[0017]The printed board (printed wiring board) 12 has wiring formed on a substrate. The printed board 12 has formed therein a plurality of through holes 12H (FIG. 2) for mounting the installation object 14 on the printed board 12. The multiple through holes 12H include multiple first through holes 12H1 and multiple second through holes 12H2.

[0018]The installation object 14 is placed at a distance from a first surface (one surface) 12A of the printed board 12. The installation object 14 may be a plate member formed in a plate shape, or may be a housing in which electronic components and the like are housed. The plate m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A connection structure includes: a support column member extending in one direction from one end to an opposite end, with the one end attached to an installation object and the opposite end having formed therein a screw hole, the support column member being configured to be non-insertable into the through hole; a surrounding member provided on a first surface of the printed board and configured to surround the opening of the through hole and to allow the opposite end of the support column member to be inserted into the surrounding member; and a fastener configured to fix the support column member to the printed board by being screw-engaged into the screw hole of the support column member inserted into the surrounding member, from a second surface side opposite to the first surface of the printed board.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2019-192613 filed on Oct. 23, 2019, the contents of which are incorporated herein by reference.BACKGROUND OF THE INVENTIONField of the Invention[0002]The present invention relates to a connection structure for connecting a printed board with an installation object which is arranged at a distance from one surface of the printed board, and an assembly including the connection structure.Description of the Related Art[0003]Japanese Laid-Open Patent Publication No. 2001-168243 discloses an electronic component module in which a second substrate is stacked in the thickness direction of a first substrate. In this electronic component module, fixing pins are connected to the first substrate and the second substrate and positioning pins are penetrated through the first and second substrates.SUMMARY OF THE INVENTION[0004]However, in the case of the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): H05K7/12H05K1/02H05K1/14
CPCH05K7/12H05K1/0284H05K1/144H05K2201/2072H05K2201/2027H05K2201/2036H05K2201/09063F16B5/02H05K7/142
Inventor MATSUDA, RYOUSASAKI, TAKU
Owner FANUC LTD