Contact-less probe of semiconductor wafers

Abstract

A device, having circuits formed thereon, comprises a circuit including a frequency generator for generating a detectable radio frequency energy when powered and a power generator, coupled to the frequency generator, for generating power when exposed to light.

Description

1. Field of the InventionThe present invention generally relates to devices for testing semiconductor wafers during manufacturing and, more specifically, to testing devices which do not contact the device under test (DUT).2. Description of the Related ArtDuring the manufacturing of semiconductor devices and wafers, unwanted defects occasionally occur. In order to reduce such defects and increase production yield it is desirable to test the item being manufactured at various points during the manufacturing process.Conventional systems remove the item being manufactured from the production line at different fabrication steps and test the item for defects. Depending on the development needs, a semiconductor wafers could be pulled at the post-silicide polysilicon stage, during the local interconnect stage or at several of the metalization stages, such as post metal-1 anneal, post via-1 planarization, or post metal-2 etch, for testing.Conventional testing systems come in physical contact...

AI Technical Summary

Problems solved by technology

During the manufacturing of semiconductor devices and wafers, unwanted defects occasionally occur.

By making physical contact with the item being manufactured, the conventional systems introduce

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