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Low activation temperature adhesive composition with high peel strength and cohesive failure

a technology of adhesive composition and low activation temperature, which is applied in the direction of synthetic resin layered products, transportation and packaging, chemistry apparatus and processes, etc., can solve the problems of requiring very costly release films, most current adhesives tend to significantly lose their bond strength, and prior art patents are not satisfactory in every asp

Inactive Publication Date: 2005-02-15
PERFORMANCE MATERIALS NA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

In a second aspect of the present invention, there is provided a resin composition made from admixing starting materials comprising:(a) 0 to 90 parts by weight of a non-olefin copolyner;(b) 5 to 95 parts by weight of a function

Problems solved by technology

Furthermore, adhesive compositions that purport to activate at low temperatures are often very soft and tacky materials such that the handling of these compositions as free films in thermal laminating processes is problematic and may require very costly release films to prevent blocking.
Also, most current adhesives tend to significantly lose their bond strength over time after they are put into service.
There are number of patents in the art that disclose adhesive compositions but these prior art patents are not satisfactory in every aspect mentioned in this specification.
In addition, it has been found that these adhesive compositions fail 100% cohesively during the peel test.

Method used

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  • Low activation temperature adhesive composition with high peel strength and cohesive failure
  • Low activation temperature adhesive composition with high peel strength and cohesive failure

Examples

Experimental program
Comparison scheme
Effect test

example 1

Table 1 shows the compositions 1A, 1B and 1C at 0 wt %, 10 wt % and 20 wt % High Impact Polystyrene (“HIPS”) respectively. These compositions were dry-blended initially and fed to a small co-rotating twin-screw extruder. The melt-compounded materials were pelletized and then blown into film with an average thickness of about 75 microns. The films were subsequently used as adhesive layers to make a 5 layer composite structure as shown in FIGS. 1a and 1b. The aluminium was aludyne treated and had a thickness of 0.38 mm. The polyethylene core used was low-density polyethylene (LDPE) sheet, 2 mm thick.

The lamination of the structures were carried out in a electrically heated press as follows (FIGS. 1a and 1b):1—Preheat the 5-layer structure for 4.5 min. @ 100° C.2—Apply pressure of 5 kgf / cm2 at 135° C. for 20 seconds.3—Release the pressure and leave the composite in the press for an additional 1.5 min. @ 135° C.4—Air cool the sample to room temperature.

The composite structure was then t...

example 2

Samples were prepared as described in Example 1 with the exception that co-extruded blown films of polyethylene / Adhesive were made and substituted for a pure adhesive film in order to reduce the cost of the adhesive used. The compositions 2A, 2B and 2C are co-extruded with a linear low density polyethylene (LLDPE) producing LLDPE-Adhesive (each layer being 25 micron thick). The results are summarized in Table 2. The co-extruded films generally result in lower peel strength as can be seen comparing 1C vs. 2A (29.8 vs. 16.5 kgf / 25 mm, respectively) but they are still functional. The addition of high impact polystyrene at 30 wt % level (2C) appears to lower the peel strength. This latter composition is still functional though not optimal.

TABLE 22-Layer Ethylene Vinyl Acetate (EVA) / Polyethylene based AdhesivesIDComp. (a)Comp. (b)Comp. (c)Comp. (d)Comp. (e)Reel StrengthFailureNo.Wt %Wt %Wt %Wt %Wt %kgf / 25 mmMode2A29.930.020.020.00.116.5100% Cohesive2B44.920.015.020.00 117.5100% Cohesive2...

example 3

In this example, compositions were made using metallocene linear low-density polyethylene as the base resin. Table 3 summarises the compositions. Samples 3A, 3B and 3C were prepared as those described in Examples 1 and 2. The last two compositions 3D and 3E were prepared in a 2-step process, in order to more closely simulate an actual commercial production. Adhesives of 3D and 3E were initially laminated to aluminium at a temperature of 149° C., using a pressure of 8.5 kgf / cm2 for 30 seconds. These pre-laminated aluminium sheets were then pressed with a pre-heated LDPE core at 132° C., using a pressure of 8.5 kgf / cm2 for 10 seconds. The peel testing was performed at a 90° angle as opposed to the 180° angle used in the other examples. Composition 3D is a repeat of 3C and is used to compare the performance between the different lamination and testing methods. Sample 3D represents much lower peel strength than 3C due to 180° peel test vs. a 90° peel for sample 3C.

Once again increasing ...

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Abstract

The present invention provides a resin composition made from admixing starting materials comprising: (a) 0 to 90 parts by weight of a polyolefin; (b) 5 to 95 parts by weight of a functional polyolefin; (c) 5 to 40 parts by weight of a polystyrenic; and (d) 0 to 30 parts by weight of an elastomer, where the total amount of components of (a), (b), (c) and (d) in the resin composition is 100 parts by weight. In a further embodiment, component (a) is a non-olefin copolymer and component (c) is high impact polystyrene. The resin compositions are useful as adhesives for metal and polyolefin substrates.

Description

FIELD OF THE INVENTIONThis invention relates to new resin and adhesive compositions, and in particular to low activation temperature adhesive compositions that can be applied as a self-supporting film or can be co-extruded or extrusion coated onto a substrate.BACKGROUND OF THE INVENTIONWhile it is known that acid-modified or anhydride-modified polymers are useful as adhesives for bonding to both metal and polyolefins, there is a need to have adhesives with not only high-bond strength to both metal and polyolefins, but also to activate the bonding at relatively lower temperatures. Conventional and currently commercially available modified polyolefins sacrifice either bonding strength to the metal or to the polyolefin, or do not activate at low temperatures when bonding to metals or polyolefins. Furthermore, adhesive compositions that purport to activate at low temperatures are often very soft and tacky materials such that the handling of these compositions as free films in thermal la...

Claims

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Application Information

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IPC IPC(8): B32B15/08C09J123/04C09J123/00C08L25/00C08L23/00C08L23/16C08L25/08C08L51/06C08L51/00
CPCB32B15/08C09J123/04C08L23/16C08L25/08C08L51/06C08L2666/24Y10T428/31692Y10T428/31696
Inventor HOJABR, SASSANTANNY, STEPHEN ROBERT
Owner PERFORMANCE MATERIALS NA INC
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