Polishing compound
a technology of polishing compound and polishing composition, which is applied in the direction of polishing composition, aqueous dispersions, other chemical processes, etc., to achieve the effect of increasing the abrasiveness and the resulting buffing effect, avoiding potential scratching of larger particles, and increasing buffing capacity
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[0012]Accordingly, a buffing composition is provided which comprises (all amounts in mass percent):
[0013]
(1) calcium carbonate 20-30%(2) feldspar 7-59%(3) smectite clay 3-7%(4) water 37-64%(5) quartz0.01-1%(6) opal CT 1-2%(7) kerosene 3-20%(8) surfactant0.01-1%(9) preservative
[0014]It is noted that opal CT may be present as naturally occurring components in a smectite process stream. It is not believed that this component affects the buffing characteristics and therefore it is not considered as part of the invention. The average particle size of the composition should be between about 30 and 45 μm, while the particle size may be up to about 100 μm. While the minimal size is preferably at least 1 μm, it should be recognized that smaller particles may be present so long as the preferred average size is achieved. A preservative, such as KATHON® CG / ICP (or CG / ICP II) from Rohm & Haas or 4,4-dimethyloxazolidine BIOBAN® CS-1135 biocide from Dow Chemicals may also optionally be prese...
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