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Defect review using image segmentation

a technology of image segmentation and defect review, applied in image enhancement, image data processing, instruments, etc., can solve the problems of disadvantageous aspects of conventional review sequences and inefficiencies

Inactive Publication Date: 2010-03-23
KLA TENCOR TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, such conventional review sequences have disadvantageous aspects and inefficiencies.

Method used

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  • Defect review using image segmentation

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first embodiment

[0025]FIG. 3 is a flow chart of a method 300 of defect analysis using image segmentation in accordance with the invention. This new approach does not require the capture of a reference image, nor does it require rendering of a simulated image.

[0026]An electron image of the area containing the previously-detected potential defect is obtained 302. In this technique 300, the field of view for the imaging may be configured to be sufficiently large such that the image may be segmented as discussed further below. Image segmentation involves dividing an imaged area into sub-areas or segments.

[0027]The image may then be aligned 304 to the computer aided design (CAD) layout of the integrated circuit. The alignment may be performed, for example, by locating a dominant edge in the image which is expected to be within the FOV based upon the design information.

[0028]A first segment or sub-area within the electron image is determined 306, where this first segment or sub-area includes the potentia...

second embodiment

[0035]FIG. 4 is a flow chart of a method 400 of defect analysis using image segmentation in accordance with the invention. This technique utilizes a relatively large field of view that includes both a local image segment at the potential defect and at least one reference image segment which is transformably-identical to the local image segment.

[0036]An electron image is obtained 402 with a relatively large field of view (FOV) in the vicinity of the previously-detected potential defect. The relatively large field of view is of a size which is substantially larger (for example, having an area 10 times to 100 times larger) than the margin of error of the previous defect detection. In other words, the relatively large field of view may be of an area size that is large enough to likely contain one or more transformably identical image segments as a local image segment containing the location of the potential defect. In other words, the relatively large field of view may be of an area siz...

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PUM

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Abstract

One embodiment pertains to a method for reviewing a potential defect on a substrate from one electron image. An image of an area containing the potential defect is obtained using a charged-particle apparatus. At least three image segments within the image are determined. The three segments are transformably identical to each other, and one of said three segments includes the potential defect. Another embodiment pertains to a method for reviewing a potential defect on a substrate by obtaining an electron-beam image of a relatively large field of view containing a first image segment. The first image segment is substantially smaller than the field of view and includes a location of the potential defect. A comparison image segment within the field of view is determined. The comparison image segment is transformably identical to the first image segment. Other embodiments and features are also disclosed.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates generally to specimen inspection and review systems.[0003]2. Description of the Background Art[0004]Automated inspection and review systems are important in process control and yield management for the semiconductor and related microelectronics industries. Such systems include electron beam (e-beam) based systems and other types of systems.[0005]Once a potential defect is detected, a typical review sequence to analyze the defect may include “die-to-database” re-detection. Such “die-to-database” re-detection typically involves comparing an image containing the defect with a reference image. The reference image is assumed to be defect-free. The reference image is typically captured from a reference integrated circuit die. Alternatively, the reference image may be a rendered image based on the CAD (computer aided design) layout of the integrated circuit.[0006]Unfortunately, such conventional r...

Claims

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Application Information

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IPC IPC(8): G06K9/00
CPCG06T7/001H01L21/67288G01R31/307G06T2207/10061G06T2207/30148
Inventor TOTH, GABOR D.MASNAGHETTI, DOUGLAS K.
Owner KLA TENCOR TECH CORP