This invention relates to the field of
engineered wood products technology, and discloses a low-absorption, crack-resistant inorganic
engineered wood product and its preparation method. The raw materials of the
engineered wood product include a substrate, inorganic mineral
powder, and a modified
adhesive. The modified
adhesive includes a gel-type
adhesive and a modifier. By
mass, the modifier includes: 40-50 parts of difluoromethoxyacrylate
emulsion, 0.2-0.5 parts of
basalt fiber, 0.2-0.4 parts of
silane coupling agent, and additives. The method uses difluoromethoxyacrylate
emulsion,
basalt fiber, and
silane coupling agent to prepare the modifier. The difluoromethoxyacrylate
emulsion particles can be adsorbed on the surface of the
basalt fiber. During the gradual curing process after the modifier and adhesive are mixed, the difluoromethoxyacrylate emulsion will dehydrate and break down, interpenetrating between the gel adhesive, basalt, substrate, and
inorganic particles, significantly reducing the
shrinkage rate of the board.