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Radiator

A radiator and fin technology is applied in the field of radiators that can effectively improve heat exchange efficiency, and can solve the problems of inability to extrude radial fins, damage to extrusion dies, and shortening of service life.

Active Publication Date: 2007-12-26
ASUSTEK COMPUTER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since most of the existing heat sinks are manufactured by (aluminum) extrusion molding, and the extrusion molding process has a certain extrusion aspect ratio limitation, the increased radial fins will make extrusion molding impossible risks, and possible damage or shortened life of extrusion dies

Method used

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Embodiment Construction

[0022] Referring to FIG. 1 and FIG. 2 , the radiator 100 of this embodiment includes a central base 110 and a plurality of fins 120 .

[0023] The central base 110 may be a hollow cylinder or a cylinder. In one embodiment, the central base 110 is a hollow cylinder. In more detail, as shown in FIG. 1, each fin 120 has a substantially identical specific curvature (or curved shape), and a plurality of fins 120 are evenly connected to the central base 110 in a radial manner ( The outer peripheral surface of the hollow cylinder) can make the heat sink 100 generally have a helical radial shape.

[0024] In particular, as shown in FIGS. 1 and 3 , each fin 120 also has a plurality of protrusions 121 , and the plurality of protrusions 121 are uniformly formed on each fin in a circumferential manner relative to the central seat 110 Tablet 120 on. In other words, a plurality of protrusions 121 are uniformly formed on each fin 120 in a circumferential direction and in the same direction...

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Abstract

A heat radiator consists of a central seat and multiple finned plates. It features that finned plate is uniformly connected on central seat in radioactive mode, each finned plate has multiple projections being formed on each finned plate uniformly in circumferential mode facing to central seat.

Description

technical field [0001] The invention relates to a radiator, in particular to a radiator that can effectively improve heat exchange efficiency. Background technique [0002] In general, current microelectronic devices (eg, integrated circuit devices, microprocessors, and other related computer components, etc.) The heat generated increases. In addition, the above-mentioned microelectronic device is usually combined with a heat sink, and the heat generated by the microelectronic device is transferred to the outside through the heat sink, so that the temperature of the microelectronic device can be reduced. However, as the heat generated by the microelectronic device increases, the heat dissipation performance of the heat sink must also be improved accordingly. [0003] In China Taiwan Patent Publications No. 519742, No. 209658 and No. 392867 respectively disclose a kind of (radial) radiator, these existing radiators mainly increase the heat dissipation area of ​​heat exchang...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/34G06F1/20H05K7/20
Inventor 林启章郑智原王恒聪
Owner ASUSTEK COMPUTER INC