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Ultraviolet illuminating method and device therewith

An irradiation device, ultraviolet technology, applied in applications, household containers, household appliances, etc., can solve problems such as damage to small pieces, inability to accurately absorb small pieces, etc., to avoid workpiece damage and achieve the effect of work efficiency

Inactive Publication Date: 2008-01-09
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When picking up small pieces from a wafer attached to a ring frame with a suction chuck for transport, the chuck may not pick up the small pieces accurately and damage the small pieces

Method used

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  • Ultraviolet illuminating method and device therewith
  • Ultraviolet illuminating method and device therewith
  • Ultraviolet illuminating method and device therewith

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Embodiment Construction

[0035] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

[0036] Fig. 1 is a front view showing main parts of a mechanical part of an ultraviolet ray irradiation apparatus according to the present invention. Fig. 2 is a perspective view of a workpiece to be processed held by a frame. A semiconductor wafer (hereinafter simply referred to as "wafer") has a UV-sensitive adhesive tape applied on its backside surface that is larger than the wafer. The adhesive tape is also applied to an annular frame at its periphery. In this embodiment, the wafer is transported with the ring frame as a unit.

[0037] The ultraviolet irradiation device in the present embodiment comprises: a workpiece loading part A, and it is used for accepting an annular frame 3 integrated with the wafer 1 from a cutting device (not shown) arranged at an upstream position; an ultraviolet irradiation part B; and, a workpiece unloading portion C, ...

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PUM

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Abstract

An ultraviolet irradiating apparatus for emitting ultraviolet light toward a work piece. The work piece, e.g. a semiconductor wafer, is held by a ring-shaped frame through an ultraviolet sensitive adhesive tape applied to the back surface of the wafer. The apparatus includes an ultraviolet irradiating section having a regulating member disposed in a lower position of a support base. The regulating member is provided to limit a downward displacement of the wafer.

Description

technical field [0001] The present invention relates to an ultraviolet irradiating device for emitting ultraviolet rays to workpieces such as semiconductor wafers or electronic components, and the ultraviolet rays of the device are also directed to a frame thereof, which passes ultraviolet rays applied to the back surface of the workpiece. Sensitive tape to hold workpieces. Background technique [0002] In conventional processes for manufacturing semiconductor wafers (hereinafter simply referred to as "wafers") or electronic components, workpieces are processed by holding the workpieces with an ultraviolet sensitive tape attached to the workpieces. [0003] Semiconductor manufacturing processes include, for example, a dicing step in which a wafer is cut into small pieces. In this dicing step, the wafer is mounted in the center of a ring frame and held (supported) by a UV-adhesive tape attached to the backside surface of the wafer so as to cover the ring frame. [0004] Tha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/301
CPCH01L21/67115H01L21/67132A47G19/186A47G2400/02
Inventor 大川雄士
Owner NITTO DENKO CORP