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Switched uniformity control

A space allocation and component technology, applied in chemical/physical/physicochemical processes, plasmas, coatings, etc. that apply energy, can solve problems such as the cost of ownership of processing tools

Inactive Publication Date: 2008-03-05
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among the issues that are important to manufacturers is the cost of ownership of process tools, which includes, for example, the cost of acquiring and maintaining the system, the frequency of process chamber cleaning required to maintain acceptable process performance, the lifetime of system components, etc.

Method used

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  • Switched uniformity control
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Examples

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Embodiment Construction

[0020] The present invention relates to an improved method and apparatus for uniform processing of substrates. The present invention achieves process uniformity by virtue of enhanced control over the distribution of the fractions of reactants used to form a process substrate in a process chamber. These components are typically part of the process method and can include power, gas flow, temperature, and the like. The invention is particularly useful in plasma processing systems where both ions and neutrals (eg, reactants) are used to process substrates. One aspect of the invention involves the spatial separation of the distribution of components into a plurality of independent regions within the processing chamber. Another aspect of the invention involves switching (or spatially modulating) the distribution of components fed from a single source between separate regions. Another aspect of the invention involves varying the magnitude and / or composition of components between sp...

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PUM

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Abstract

A component delivery mechanism for distributing a component inside a process chamber is disclosed. The component is used to process a work piece within the process chamber. The component delivery mechanism includes a plurality of component outputs for outputting the component to a desired region of the process chamber. The component delivery mechanism further includes a spatial distribution switch coupled to the plurality of component outputs. The spatial distribution switch is arranged for directing the component to at least one of the plurality of component outputs. The component delivery mechanism also includes a single component source coupled to the spatial distribution switch. The single component source is arranged for supplying the component to the spatial distribution switch.< / PTEXT>

Description

technical field [0001] The present invention relates to apparatus and methods for processing substrates such as semiconductor substrates for IC fabrication or glass panels for flat panel displays. More specifically, the present invention relates to improved processing systems capable of processing substrates with high processing uniformity across the substrate surface. Background technique [0002] During the manufacture of semiconductor-based products such as flat-panel displays or integrated circuits, multiple deposition and / or etch steps may be performed on the substrate surface to form components such as transistors, capacitors, resistors, interconnects, etc. device. During deposition, layers of various materials are successively deposited on the surface of a substrate to form a stack. For example, an insulating layer, a conductive layer, a semiconductor layer may be formed on the surface of the substrate. Instead, etching can be performed to selectively remove variou...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/52H01L21/3065H05H1/46B01J4/00B01J19/08C23C16/50H01J37/32H01L21/205
CPCH01J37/3244H01J37/321H01J37/32
Inventor R·A·戈特肖R·J·斯特格尔
Owner LAM RES CORP