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Dynamic height adjusting system and method for head assembly of laser processing system

A technology of laser processing and adjustment methods, which is applied to laser welding equipment, metal processing equipment, manufacturing tools, etc., and can solve problems such as voltage fluctuations, signal interference errors, and inapplicability

Active Publication Date: 2014-10-01
IPG PHOTONICS CORP
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Problems solved by technology

Recognizing that this complex signaling approach employs delays in signal determination, easily compromised by voltage fluctuations, signal interference errors, and inability to continuously record measured capacitance over the duration of individual laser pulses during welding
This approach is not suitable for continuous adaptation to high-speed laser processing in an integrated dynamic production cycle

Method used

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  • Dynamic height adjusting system and method for head assembly of laser processing system
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  • Dynamic height adjusting system and method for head assembly of laser processing system

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Embodiment Construction

[0026] Reference will now be made in detail to the embodiments of the invention. Where possible, the same or similar reference numerals are used in the drawings, and descriptions thereof refer to the same or similar parts or steps. The drawings are in simplified form and are not to exact scale. Directional designatory terms may be used with respect to the drawings for the sake of convenience and clarity only. These similar directional terms should not be construed to limit the scope of the invention in any way.

[0027] refer to figure 1 , an alternative of the present invention proposes a dynamic height adjustment system 10 of a head assembly of a laser processing system (incorporated via a cutting head as shown). The various elements communicate and are operatively connected to enable system 10 to operate in successive cycles. The system 10 comprises a base station 1 having at least one and optionally several process controllers 2 operatively connected to a cutting head ...

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Abstract

The present invention relates to a dynamic height adjusting system and method that uses capacitance for a head assembly of a laser processing system throughout a process cycle. The proposed system and method involves use of a single frequency in which a change in phase is measured and processed to determine changes in height and distance between a work piece with an increased reliability. The system further enables operative computerized processor control and substantial improvements in process control signal and feedback distribution throughout an integrated system and optional remote interfaces.

Description

technical field [0001] The present invention relates to a dynamic height adjustment system and method preferably for use with a laser processing system. More specifically, the present invention provides a dynamic cutting head height adjustment system that includes the use of a single frequency, wherein phase changes are processed to determine changes in height on the workpiece with increased reliability and enhanced process control. Background technique [0002] A cutting head assembly for a laser processing system is recognized in applicant's innovative development in US Patent Application No. 61 / 542,156, filed October 1, 2011, the entire contents of which are incorporated herein by reference. Applicants' cutting heads optionally include a co-site or remote computerized process controller for use as described herein. This system discusses an efficient system for machining a workpiece by a laser beam. [0003] A method for monitoring the heat treatment (welding) of workpie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/03B23K26/046B23K26/38B23K26/14G01B7/02
CPCB23K26/38B23K26/03G01B7/023B23K26/0869B23K26/048B23K26/147G01B7/02
Inventor 沃尔特·莱斯利彼得·卡斯塔尼亚
Owner IPG PHOTONICS CORP
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