System and method of heat dissipation in semiconductor devices

Abstract

The present disclosure provides a method and system for heat dissipation in semiconductor devices. In one example, an integrated circuit semiconductor device includes a semiconductor substrate; one or more metallurgy layers connected to the semiconductor substrate, and each of the one or more metallurgy layers includes: one or more conductive lines; and one or more dummy structures between the one or more conductive lines and at least two of the one or more dummy structures are connected; and one or more dielectric layers between the one or more metallurgy layers.

Description

technical field [0001] The present invention relates to the design and manufacture of semiconductor devices, and more particularly to a system and method for dissipating heat from semiconductor devices. Background technique [0002] The effect of heat dissipation from semiconductor devices is well known. For example, a typical microprocessor typically consumes about 40 watts of electricity, most of which eventually turns into heat. However, if the heat is not dissipated properly, the performance of the electronic device can be reduced - poor heat dissipation can cause damage to the electronic device and reduce the reliability and life expectancy of the device. [0003] Generally, heat generated in semiconductors is dissipated by conduction through the device. Heat is usually dissipated simply through the materials used to form the underlying wiring structure of the semiconductor device. Often no special structures are provided to assist in heat dissipation within semicond...

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Problems solved by technology

However, most low dielectric materials have poor thermal conductivity

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