Heat elimination type structure for packing complex crystal
A flip chip packaging and heat dissipation technology, applied in electrical components, electric solid state devices, circuits, etc., can solve problems such as inconvenience, inability to dissipate heat energy from heat sources in time, and insufficient heat dissipation area of heat sink 50.
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[0049] see figure 2 Shown is a first embodiment of the heat dissipation flip chip package structure of the present invention. The heat dissipation flip chip package structure 100 includes a substrate 110 , a flip chip 120 and a heat sink 130 . The substrate 110 has an upper surface 111 . In this embodiment, the heat dissipation flip chip package structure 100 includes a plurality of solder balls 140 disposed on the lower surface 112 of the substrate 110 . The flip chip 120 is bonded to the upper surface 111 of the substrate 110 , and the flip chip 120 has a back surface 121 . In this embodiment, the flip chip 120 is electrically connected to the substrate 110 through a plurality of bumps 122 .
[0050] The radiator 130 is arranged on the back surface 121 of the flip chip 120, wherein the radiator 130 includes a heat dissipation shell 131 and a coolant 132, the heat dissipation shell 131 is a closed space, and includes a bottom heat exchange part 133, A top heat exchange pa...
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