Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board
A technology of multi-layer printing and process method, which is applied in the direction of electrical connection formation of printed components, etc., can solve the problems of inflexibility and poor bending of flexible multi-layer printed circuit boards, so as to increase the number of bending times and increase flexibility. degree, the effect of increasing the folding resistance
Active Publication Date: 2008-11-12
CHUNHUA TECHNOLOGICAL KUSN
View PDF4 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
The steps are: after through-hole electroplating, use the method of current conduction to thicken the chemical copper on the wall of the through-hole. At this time, in addition to thickening the copper on the wall of the through-hole, the original copper is also electroplated. A layer of copper, and the formation of this layer of copper is electrolysis, the arrangement of copper crystals is granular and longitudinally expanded, while the original copper is processed by rolling, and the arrangement of copper crystals is horizontally expanded, so the traditional Flexible multilayer printed circuit boards made by copper plating are not resistant to folding and have poor bending properties
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment
[0019] Example: see Figure 1 to Figure 5 , a process method for selective copper plating of via holes of a flexible multilayer printed circuit board, which is completed according to the following steps: a. ;b. Lamination: a layer of dry film is pressed on the flexible multilayer printed circuit board after through-hole electroplating; c. Exposure: the dry film at the position of the via hole is exposed by the principle of film exposure, and the dry film at other positions is exposed. Retain; d. Visualization: Visualize the via hole ring on the copper foil, that is, remove the dry film on the via hole; e. Copper plating: At this time, except for the via hole ring position exposed, other Part of it is covered with dry film, so when electroplating, only the via hole is electroplated; f. Stripping: the dry film is stripped off by the principle of reacting with chemical solution.
[0020] In this example, a layer of dry film is respectively pressed on the copper foil surfaces of ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The method includes: 1) plates through-hole on the flexible multilayer circuit board on which the through-hole is drilled; 2) presses a dry film on the flexible multiplayer circuit board whose through-holes are plated; 3) light exposing method is used to indicate the location of the through-hole; 4) develops the image of through-hole on the copper foil to distinguish the location of through-hole from the other area covered by the dry film; 5) plates the through hole with copper; 6) remove the dry film by using chemical agent. The flexible multilayer circuit board can bear 60,000-100,000 times of bending.
Description
technical field [0001] The invention relates to a process method for copper plating on a printed circuit board. Background technique [0002] In the current flexible multilayer printed circuit board, the multi-layer board is connected by drilling through holes, and then plating the through holes with copper. The traditional copper plating method is copper plating on the entire board, that is, when the via holes are plated with copper, the entire board surface is also plated with copper. The steps are: thicken the chemical copper on the wall of the through hole by using the current conduction method after electroplating the through hole. At this time, in addition to thickening the copper on the wall of the through hole, the original copper is also plated A layer of copper, and this layer of copper is formed by electrolysis, the arrangement of copper crystals is granular and longitudinally expanded, while the original copper is processed by rolling, and the arrangement of cop...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42C25D5/02
Inventor 李古冬刘咏东莫卫龚张宁
Owner CHUNHUA TECHNOLOGICAL KUSN