Micro channel making equipment and process

Abstract

The present invention discloses one kind of micro channel making equipment and process. The equipment includes a fixed shaft, a rotating shaft, a seat, an integral cutter, a positioning mold, a fixed mold connected to the positioning mold, a sliding mold and shaping mold connected to the fixed mold, a copper pipe constituting sealed cavity for leading oil in together with the molds, and a spinning ball holder with spinning ball located inside the sealed cavity. The holder with notch and the spinning ball extrude the copper pipe, and the fixed mold and the sliding mold with slant limit the position of the holder. The micro channel making process includes transferring rotating pressure with the spinning ball via the high pressure oil layer and deforming the copper pipe with the action of complex extrusion force to produce local plastic deformation and form the micro channel. The present invention is simple and reliable, and the copper pipe with micro channel is light.

Description

technical field [0001] The invention relates to a manufacturing device and a manufacturing method of a heat transfer element of an electronic device, in particular to a manufacturing device and a manufacturing method of a micro-groove on the inner wall of a copper tube. Background technique [0002] With the emergence of new features and phenomena such as the rapid increase of chip heat flux density in the field of microelectronics and the increasingly narrow effective heat dissipation space, the traditional method of increasing the effective heat dissipation area for heat dissipation can no longer meet the heat dissipation requirements. It has high thermal conductivity and good heat dissipation. Small / miniature heat pipes with the advantages of isothermal, fast thermal response, simple structure, and no need for additional electric drive become ideal components for heat conduction of high heat flux chips. The heat transfer performance of the heat pipe mainly depends on the ...

AI Technical Summary

Problems solved by technology

Although the void ratio of the built-in wire mesh liquid-absorbing core structure can reach 45-75%, it also increases the weight of the heat pipe. In addition, the processing environment must be carried out in a vacuum welding room with a vacuum system, so the processing environment is quite demanding. At the same time, for small thin-walled heat pipes, it is extremely inconvenient to operate with a wire mesh inside the tube, and the contact between the metal braided mesh and the inner wall of the heat pipe is not tight, which leads to an increase in its radial thermal resistance and affects heat transfer. Performance, and high production costs, this method is basically no longer used

The heat pipe with a smooth grooved liquid-absorbing core structure has the advantages of thin wall, light weight, no contact thermal resistance, fast thermal response, and the structure of the liquid-absorbing core is not easily damaged, which is in line with the development trend of light, thin, short and miniaturized electronic devices, but there is Disadvantages of less stress

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