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Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering

A silver-based alloy, vacuum circuit breaking technology, applied in welding equipment, welding medium, metal processing equipment and other directions, can solve the problems of increasing process steps and costs, poor wettability of stainless steel, and brazing time affecting device performance, etc. The effect of shortened brazing time, improved wetting properties, and reduced impact

Inactive Publication Date: 2008-12-03
SINO PLATINUM METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Excessive brazing time will also affect the performance of the device
However, the wettability of AgCu50 solder to stainless steel is not good, and Ni plating treatment is required, which increases the process steps and cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] Example 1 Take 10 kilograms per furnace, AgCu45% Ni 1-3% as an example, weigh on a balance with an accuracy of 0.1 g, weigh pure Ag: 5400-5200 g, pure Cu: 4500 g, and pure Ni: 100- 300 grams. Put all the charge into the furnace at one time, and vacuum up to 1×10 -2 Pa, heat up to 1100°C to melt the charge, after all the charge is melted, cool down and solidify. Then vacuum again to reach 1×10 -2 Above Pa, protect with Ar gas, increase the temperature to melt the charge uniformly, and cast into the required billet. For strip products, the cast ingot undergoes processes such as hot-rolled billeting, intermediate rolling, annealing, and finishing rolling to obtain the required products. For wire products, the required products can be obtained from the ingot after extrusion, drawing, annealing, and drawing.

Embodiment 2

[0009] Example 2 Taking 10 kg per furnace, AgCu45%Ni4~5% as an example, weighing on a balance with an accuracy of 0.1 g, weighing pure Ag: 7000-6700 g, pure Cu: 3900-4000 g, CuNi50 intermediate alloy: 800~1000 grams. Put all the charge into the furnace at one time, and vacuum up to 1×10 -2 Pa, heat up to 1200°C to melt the charge, after all the charge is melted, cool down and solidify. Then vacuum again to reach 1×10 -2 Above Pa, protect with Ar gas, increase the temperature to melt the charge uniformly, and cast into the required billet. For strip products, the cast ingot undergoes processes such as hot-rolled billeting, intermediate rolling, annealing, and finishing rolling to obtain the required products. For wire products, the required products can be obtained from the ingot after extrusion, drawing, annealing, and drawing.

Embodiment 3

[0010] Example 3 Taking 10 kg per furnace, AgCu45%Ni2% as an example, weighing on a precision 0.1g balance, weighing pure Ag: 6900~6800 g, pure Cu: 3950~4000 g, CuNi50 intermediate alloy: 800~ 1000 grams. Put all the charge into the furnace at one time, and vacuum up to 1×10 -2 Pa, heat up to 1200°C to melt the charge, after all the charge is melted, cool down and solidify. Then vacuum again to reach 1×10 -2 Above Pa, protect with Ar gas, increase the temperature to melt the charge uniformly, and cast into the required billet. For strip products, the cast ingot undergoes processes such as hot-rolled billeting, intermediate rolling, annealing, and finishing rolling to obtain the required products. For wire products, the required products can be obtained from the ingot after extrusion, drawing, annealing, and drawing.

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PUM

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Abstract

The invention relates to an Ag alloy solder used to improve the sealing property of vacuum device, which can reduce the solder cost, wherein based on the AgCu alloy solder, it adds some Ni component, to improve the property of solder, and improve the humidify property and welding strength of mother base of solder, and replace the Pd group solder in multi-stage welding, and reduce the cost.

Description

Technical field [0001] The invention relates to a silver-based alloy solder, in particular to a silver-copper alloy solder and its application in staged brazing of vacuum circuit breakers. Background technique [0002] Vacuum electronic devices are composed of multiple materials connected by welding methods, with complex structures and high dimensional accuracy requirements. Brazing is the most commonly used method. Due to the different properties of brazing base materials, multi-stage brazing is usually required from high temperature to low temperature in the sealed connection. For parts with larger gaps, AgCu50 is widely used at home and abroad for brazing, and the brazing temperature reaches 900°C, which takes a long time. Long soldering time will also affect the performance of the device. However, the AgCu50 solder has poor wettability to stainless steel, and requires Ni plating, which increases the process steps and costs. Summary of the invention [0003] After adding Ni c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K1/19
Inventor 蒋传贵李靖华张利斌孔建稳
Owner SINO PLATINUM METALS CO LTD