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LED lighting lamp and its manufacturing method

A technology of LED lighting and manufacturing method, applied in the field of lighting, can solve problems such as LED damage and incapacity, and achieve the effects of full contact, saving man-hours, and saving materials

Inactive Publication Date: 2008-12-31
连伟 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In addition, since the distance between the solder joint and the LED lamp body is very close during welding, generally 2 to 5 mm, there are strict restrictions on the welding time and temperature, otherwise the LED may be damaged. When using LED lighting fixtures, this method seems powerless

Method used

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  • LED lighting lamp and its manufacturing method

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Embodiment Construction

[0018] The invention provides an LED lighting fixture, which uses several LED lamps as light sources. The pins of these LED lamps pass through an insulating substrate and are connected to each other on the back of the insulating substrate according to a predetermined circuit structure. The LED lamps used in the present invention can be 2-pin LEDs such as various cylindrical, conical, and straw hat-shaped LEDs, or piranha LEDs, and multi-pin special-shaped LEDs. Based on the above structure, theoretically speaking, there is no special requirement for the insulating substrate, and any solid insulating material can be used, such as glass plate, PCB board, plastic plate, etc. In the present invention, ceramic plates with low price and good insulating effect are preferred, especially It is currently the most popular ultra-thin ceramic plate for research and development. Its material is thin (up to about 3mm), high strength, light weight, smooth and delicate surface, which is conduc...

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Abstract

The invention discloses an LED lighting fixture, which comprises an insulating substrate, several LED lamps and a heat-conducting packaging layer. The pins of the LED lamps pass through the insulating substrate and are connected according to a set circuit structure. The heat-conducting packaging layer The connected pins are sealed on the back of the insulating substrate. The invention also provides a manufacturing method of the above-mentioned lamp. The advantage of the present invention is that it is convenient and material-saving to directly use the pins of the LED for connection; in addition, since the heat-conducting encapsulation layer is laid on the back of the insulating substrate to seal the pins, the contact between the heat-conducting material and the pins is quite sufficient, It can conduct good heat conduction with the pins, and at the same time, the heat dissipation area is greatly increased, which can allow high-density LED installation, and is beneficial to improving the luminous intensity per unit area of ​​the lighting fixture.

Description

【Technical field】 [0001] The invention relates to lighting technology, in particular to an LED lighting fixture and a manufacturing method thereof. 【Background technique】 [0002] LED, that is, light-emitting diode, has been widely used in various occasions such as landscape lighting and large-screen display due to the rapid development of main technical indicators such as brightness in recent years, and will enter the field of general lighting on a large scale. In the process of energizing and emitting light, LED will generate a lot of heat. These heats are very harmful to LED devices, and the generated heat must be dissipated by appropriate means to ensure that the LEDs work within an appropriate temperature range. Commonly used LED devices have various packaging forms, such as: cylindrical, conical, straw hat and other 2-pin LEDs, piranha LEDs, SMD LEDs, and multi-pin special-shaped LEDs, etc. Manufacturers have taken heat dissipation into consideration when designing a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S4/00F21V19/00F21V29/00F21W131/00F21Y101/02F21V29/85F21Y115/10
Inventor 吕大明连伟
Owner 连伟
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