Picture element structure and producing method thereof
A technology of pixel structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, optics, instruments, etc., can solve the problems of reliability and cost increase, and achieve the best reliability and simple process
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[0041] 2A to 2C are schematic diagrams of a method for manufacturing a pixel structure according to an embodiment of the present invention. Referring to FIG. 2A , the manufacturing method of the pixel structure in this embodiment includes the following steps. First, a substrate 210 is provided, and then a gate 220 is formed on the substrate 210 . More specifically, a first conductive layer (not shown) is formed on the substrate 210 first, and then a patterning process is performed on the first conductive layer to form a gate 220 . Then, a first patterned dielectric layer 230 is formed on the substrate 210 to cover the gate 220, and the first patterned dielectric layer 230 has a plurality of bumps 230a and at least one opening 230b, wherein the bumps 230a are configured on the substrate 210 exposed by the opening 230b. The bumps 230a may be arranged in random numbers or a predetermined specification. In more detail, a first dielectric layer (not shown) is formed on the subst...
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Abstract
Description
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