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Radiating system for communication apparatus

A heat dissipation system and communication equipment technology, applied in cooling/ventilation/heating transformation, instrument cooling, instrument parts, etc., can solve problems such as large number of fans, unfavorable design and application, and restrictions on the design and application of backplane 18, etc. Achieve good heat dissipation effect, simple and practical structure, and expand the application range

Inactive Publication Date: 2009-01-21
XIAN RUIXIN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the blowing duct of this structure has at least two main disadvantages. The first is that there are many fans, and the front frame part 11 and the rear frame part 12 all need fans; the second is that the fan frame 13 is an integral structure and is arranged on Below the entire frame part, if the backplane 18 is required to extend downward for some reason, it cannot be done, which limits the design and application of the backplane 18 and is not conducive to the design and application of the product

Method used

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  • Radiating system for communication apparatus
  • Radiating system for communication apparatus

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Embodiment Construction

[0022] Please refer to FIG. 2 , the embodiment of the heat dissipation system for communication equipment of the present invention includes an equipment cabin, and the equipment cabin may be a subframe, a subrack, or the like. The upper end of the equipment cabin is an air outlet part 100 , the lower end is an air inlet part 200 , and between the air inlet part 200 and the air outlet part 100 is a plate part 300 . The air outlet part 100 is provided with an air outlet 101 communicating with the outside to discharge the air in the equipment cabin; the air inlet part 200 is provided with an air inlet 201 communicating with the outside and introducing cold air from the outside into the equipment cabin. The insert plate part 300 communicates with the air inlet part 200 and the air outlet part 100 respectively.

[0023] The board part 300 is provided with a backplane 303 which divides it into a first board part 301 with high power consumption and a second board part 302 with low po...

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Abstract

Cabin body of equipment includes three parts: air outlet at up end, air inlet at low end, and insert plate in middle part. The insert plate includes backboard for first and second insert plates. First plate separates out part of large power consumption, and second plate separates out part of small power consumption. Breakwind assembly of air inlet with second plate is setup at air inlet part. Air return port is setup at up part of the second plate part. Fan at the first insert plate part inducts external cold air from air inlet to cool first plate part. Partial heat exchanged cool air is exhausted through air outlet to outside; and another part heat exchanged cool air enters to second insert plate part to carry out cooling driven by air pressure difference. Comparing prior art, the invention reaches same even better effect of heat elimination after omitting fan frame and fan. Making structure simple, the invention extends application by allowing backboard to be extended downwards.

Description

technical field [0001] The invention relates to electronic communication equipment, in particular to a cooling system in the electronic communication equipment. Background technique [0002] At present, in order to improve system integration or partition according to different functions, some electronic communication equipment divides the equipment cabin (subrack or box) into front and rear parts, that is, a backplane is set in the middle or a certain part inside the subrack, and the front and back of the backplane All have veneers. Some standards (such as the PICMG3.0ATCA standard) also recommend this distribution of boards, that is, it is stipulated that the front board is a service processing board, the rear board is an interface board, and the front board and the rear board are connected through connectors. The size of the front board is large (depth 280mm), and the power consumption is also large (such as 180W), while the size of the rear board (depth 70mm) and power c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/467G06F1/20G12B15/04
CPCY02B60/1275Y02D10/00
Inventor 池善久
Owner XIAN RUIXIN TECH CO LTD