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Method of utizing jet in preparing anisotropic conductive adhesive film and device thereof

A technology of droplet spraying and conductive adhesive film, which can be applied to devices, coatings, special surfaces and other directions for applying liquid to the surface, which can solve the problems of difficult operation, high cost and less obvious effect.

Active Publication Date: 2009-02-11
HAISO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These solutions are either difficult to operate and costly, or the effect is not obvious, so the present invention emerges at the historic moment

Method used

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  • Method of utizing jet in preparing anisotropic conductive adhesive film and device thereof
  • Method of utizing jet in preparing anisotropic conductive adhesive film and device thereof
  • Method of utizing jet in preparing anisotropic conductive adhesive film and device thereof

Examples

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preparation example Construction

[0024] Such as figure 1 and figure 2 Shown is the flowchart of the preparation method of the anisotropic conductive adhesive film of the present invention and the morphological diagram of the spraying of the present invention to form the conductive layer. The manufacturing method of the anisotropic conductive adhesive film 14 comprises the following three steps in turn: (1) in the resin Coating one layer of insulating resin 11 on the support body 10 with resin layer of making film or surface; (2) spraying the liquid composition containing metal conductive particles made to the resin layer formed in step (1) from the liquid drop ejection head (3) coating a layer of insulating resin 13 on the conductive layer 12 formed in step (2).

[0025] The insulating resin for coating the first layer is composed of silicone oil resin, polyamide resin, oleic acid amide and other anti-adhesive resins and antistatic agents. The antistatic agents are mainly non-ionic and cationic surfactants....

Embodiment 1

[0051] It is required to manufacture an anisotropic conductive adhesive film suitable for electrode width of 8 μm and line spacing of 5 μm:

[0052] According to the above requirements, we use the conductive microspheres described in the patent application number 200510018992.1 as the conductive particles. The diameter of the conductive particles is 0.3 μm, the concentration of the conductive particles is 20%, and the diameter of the nozzle is 8 μm. Operate as follows.

[0053] Pass the resin film or the support with the resin layer on the surface through the coating device 1, the spraying device, the coating device 2, the transmission device (see Figure 7 ), adjust the temperature of the heated bottom plate to a suitable temperature, start the coating device 1 and the coating device 2, input signals to the terminal control part 51 in advance to start the spraying device and the transmission device, and make the resin film or the support with a resin layer on the surface When...

Embodiment 2

[0055] It is required to manufacture an anisotropic conductive adhesive film suitable for electrode width of 20 μm and line spacing of 15 μm

[0056] According to the above requirements, we use gold balls as the conductive particles, the diameter of the conductive particles is 1 μm, the concentration of the conductive particles is 80%, the diameter of the nozzle is 12 μm, and t=0.1 second.

[0057] Concrete operation is the same as embodiment 1

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Abstract

The present invention provides one jet set and the method of using the jet in preparing anisotropic conductive adhesive film. The jet set includes one working platform, one heating base board, one upper shift assembly, and one liquid drop generator in the shift assembly and including one liquid drop nozzle, one liquid supplying unit, one controlling unit, one pair of tracks and one pair of columns. After receiving the signal from the control terminal, the controlling unit operates and the nozzle jets liquid drop containing conducting particles to form conducting layer. The present invention can locate the conducting component effectively through simple operation, and can form anisotropic conductive adhesive film for connecting microelectronic elements and devices with low failure rate and low cost.

Description

technical field [0001] The invention relates to a method for preparing anisotropic conductive adhesive film by using a droplet spraying device and a device for realizing the method. Background technique [0002] With the rapid development of microelectronics technology, the application of small chips, large-scale integrated circuits, and ultra-large-scale integrated circuits is becoming more and more common, which requires more and more requirements for anisotropic conductive adhesive films as connecting materials for microelectronic components. high. [0003] Conventionally, the conductive components in the anisotropic conductive adhesive film are randomly and uniformly distributed, and are formed by fully mixing the resin binder and the conductive components and then laying them flat. When connecting relatively fine electronic circuits, short circuits or open circuits often occur. Therefore, the orderly discharge of the conductive component matching circuit becomes a ver...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C9/00B05D5/00
Inventor 于洁袁明王琛周遂新
Owner HAISO TECH