Method for sticking adhesive tape for die bonding and the method for mounting electronic component
A technology for small chip bonding and electronic components, applied in the direction of bonding methods, electrical components, electrical solid devices, etc., can solve the problems that the peeling film cannot be detected, the overall time of electronic component installation work cannot be shortened, and electronic components cannot be quickly processed.
Inactive Publication Date: 2009-03-04
SHIBUYA IND CO LTD
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Problems solved by technology
Therefore, removal of the release film from the adhesive tape cannot be detected when using an infrared sensor
Even if the material of the release film is opaque, it is difficult to quickly detect the removal of the release film by the infrared sensor
Therefore, after the adhesive tape is attached to the substrate, the electronic components cannot be quickly mounted on the adhesive tape.
[0020] In addition, since a device for performing the step of attaching the aforementioned adhesive tape to the substrate and a device for performing the step of mounting the electronic components on the adhesive tape are respectively provided, these steps cannot be continuously performed.
Therefore, the overall time for electronic component mounting work cannot be shortened
Method used
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Embodiment Construction
[0046] Next, a method of attaching the adhesive tape for die bonding and a method of mounting electronic components according to an embodiment of the present invention will be described with reference to the drawings.
[0047] First, refer to figure 1 and figure 2 , a method of attaching an adhesive tape for bonding dies by attaching an adhesive film to a substrate according to an embodiment of the present invention will be described.
[0048] The sticking device 50 is used in the sticking method of the adhesive tape for die bonding (hereinafter simply referred to as "adhesive tape") of the embodiment. Such as figure 1 and figure 2 As shown, the sticking device 50 is a device for sticking the adhesive film 10 on the position 2 of the substrate 1 . The adhesive film 10 is a device for mounting a semiconductor chip (hereinafter simply referred to as a “chip”) 40 as an electronic component on the substrate 1 .
[0049] The sticking device 50 has a cutting section for cut...
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First, a prescribed position (2) on a substrate (1) is recognized by an image pick up mechanism (14). Next, a piece (12) including an adhesive film (10) is held by a holding mechanism (13). Then, based on the result of the recognition of the prescribed position (2), the holding mechanism (13) shifts and the adhesive film (10) is stuck at the prescribed position (2). In the steps above, the holding mechanism (13) and the image pick up mechanism (14) can independently move. Therefore, the step of recognizing the prescribed position (2) and the step of holding the piece (12) can be performed at the same time.
Description
technical field [0001] The present invention relates to a method of attaching an adhesive tape for die bonding for mounting electronic components at predetermined positions on a substrate, and a method of mounting electronic components on a substrate using the adhesive tape. Background technique [0002] The conventional method is to attach electronic components to substrates with adhesive tapes. In this method, an adhesive tape for bonding dies having adhesive properties on both main surfaces is used. This method is performed as follows. [0003] First, cut the adhesive tape with the release tape attached. Thus, a single sheet with a release tape is prepared. The single piece moves while being held by the holding mechanism. Then, the single chip is placed on a predetermined position on the substrate by a holding mechanism. This step is called the temporary crimping step. [0004] Next, the single piece placed on the substrate is crimped on the substrate by a crimping ...
Claims
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IPC IPC(8): H01L21/52H01L21/68C09J5/00C09J7/10
CPCH01L21/68H01L24/743C09J5/00C09J7/00H01L21/52H01L2224/743H01L2924/14C09J7/10H01L2924/00
Inventor 森泽匡史新田一法荫山秀生东秀和
Owner SHIBUYA IND CO LTD