Active element array base-board and manufacturing method
A technology for active components and array substrates, which is applied in semiconductor/solid-state device manufacturing, electrical components, and electrical solid-state devices, etc., can solve problems such as uneven display display, and achieve the effect of alleviating display unevenness and low cost.
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no. 1 example
[0042] Figure 1A to Figure 1B It is a schematic plan view of the manufacturing process of the active device array substrate according to a preferred embodiment of the present invention. Figure 2A to Figure 2D is a schematic cross-sectional view of the manufacturing process of the active element array substrate according to a preferred embodiment of the present invention, which is Figure 1A to Figure 1B The sectional view along I-I' in the middle.
[0043] First, please also refer to Figure 1A and Figure 2A According to the manufacturing method of the active device array substrate of the present invention, a substrate 100 is firstly provided. Then, several scanning wirings 102 , several data wirings 104 and several active devices 106 are formed on the substrate 100 . Each active device 106 is electrically connected to the corresponding scanning wiring 102 and data wiring 104 . The active device 106 is, for example, a thin film transistor, which includes a gate electrod...
no. 2 example
[0050] In the first embodiment, a passivation layer is formed under the organic material layer of the active device array substrate. After wiring, the organic material layer is directly formed, and its detailed description is as follows:
[0051] Figure 3A ~ Figure 3D It is a sectional view of the manufacturing process of the active device array substrate according to the second embodiment of the present invention. Please refer to Figure 3A According to the manufacturing method of the active device array substrate provided by the present invention, the substrate 100 is firstly provided. Then, scan wiring 102 , data wiring 104 and active element 106 are formed on the substrate 100 . Each active device 106 is electrically connected to the corresponding scanning wiring 102 and data wiring 104 .
[0052] Next, please refer to Figure 3B A layer of organic material 300 is formed on the substrate 100 to cover the above-mentioned scanning wiring 102 , data wiring 104 and activ...
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Abstract
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