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Thin surface mounted solid electrolytic capacitor and manufacturing method thereof

A technology of solid electrolysis and capacitors, applied in the direction of solid electrolytic capacitors, electrolytic capacitors, fixed capacitor dielectrics, etc., can solve the problem of insufficient resin sealing.

Inactive Publication Date: 2009-03-18
TOKIN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, the degree of sealing of the outer refined resin is not always sufficient

Method used

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  • Thin surface mounted solid electrolytic capacitor and manufacturing method thereof
  • Thin surface mounted solid electrolytic capacitor and manufacturing method thereof
  • Thin surface mounted solid electrolytic capacitor and manufacturing method thereof

Examples

Experimental program
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Embodiment Construction

[0021] refer to figure 1 , the first conventional solid electrolytic capacitor will be described first to facilitate the understanding of the present invention. figure 1 is a sectional view of the first conventional solid electrolytic capacitor, similar to that of the above-mentioned JP-A-5-275290 figure 1 The sectional view shown in .

[0022] The illustrated solid electrolytic capacitor comprises an aluminum foil 11 having an extended surface formed by etching. Therefore, the aluminum foil 11 can be called an etched aluminum foil. The aluminum foil 11 is divided into first and second regions 11-1 and 11-2, which are positioned at figure 1 Left and right sides of the paper. The first zone 11 - 1 of the aluminum foil 11 is intended to be connected to the outer anode terminal 12 . The second area 11 - 2 of the aluminum foil 11 occupies a larger part of the aluminum foil 11 and is called a capacitive display area. An aluminum oxide film 13 is formed on the capacitive displ...

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PUM

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Abstract

An external cathode terminal (16) is adhered to one surface of a capacitor element while a prepreg (25) is adhered to another surface of the capacitor element. A reinforcement plate (26) is adhered to the prepreg. Heat and pressure are applied to the external cathode terminal, the prepreg, and the reinforcement plate to elute thermosetting resin from the prepreg in the side of the capacitor element, thereby sealing the side of the capacitor element with eluted material (27A, 27B). Inasmuch as transfer molding is not used as exterior package, the element never deforms by injection pressure of resin. It is possible to thin by a thickness of exterior package resin. Inasmuch as eluted thermosetting resin does not include a mold release agent, it has good adhesion for the external cathode terminal.

Description

[0001] This application claims priority from the prior application JP2002-208998, the disclosure of which is incorporated herein by reference. technical field [0002] The present invention relates to a solid electrolytic capacitor and its manufacturing method, in particular, to a technique for packaging a solid electrolytic capacitor using a planar capacitor element. Background technique [0003] Surface mount type solid electrolytic capacitors are well known in the art. For example, a surface mount type solid electrolytic capacitor includes an anode electrode composed of a valve-acting metal such as titanium, aluminum, etc., a dielectric obtained by oxidizing the valve-acting metal as a base material of the anode electrode, firmly formed A conductive layer made of manganese dioxide, conductive macromolecules, etc. on the dielectric, and a cathode electrode obtained by laminating a graphite layer or a silver paste layer on the conductive layer. As is well known in the art,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G9/15H01G9/00H01G9/08H01G2/06H01G2/08H01G2/10H01G4/06H01G4/224H01G4/35H01G9/042
CPCH01G9/15H01G9/042H01G9/08H01G2/065
Inventor 荒井智次猪井隆之斋木义彦户井田刚
Owner TOKIN CORP