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Method for preventing electric connector inclination while fixing it onto substrate

A technology for electrical connectors and substrates, which is applied in the directions of fixed connection, conductive connection, and components of connecting devices, and can solve the problem of not being able to use BGA connectors.

Inactive Publication Date: 2009-03-18
CONNECTOR SYST TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the self-centering capabilities of BGA connectors, however, many solutions used in SMT connectors cannot be used with BGA connectors

Method used

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  • Method for preventing electric connector inclination while fixing it onto substrate
  • Method for preventing electric connector inclination while fixing it onto substrate
  • Method for preventing electric connector inclination while fixing it onto substrate

Examples

Experimental program
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Embodiment Construction

[0031] Each of the alternative embodiments described herein relates to a surface mount electrical connector with a strain relief feature. Preferably, the fusible elements, such as solder balls, secure the contacts to the conductive elements on the substrate using Ball Grid Array (BGA) technology. Because the BGA connector can be precisely aligned relative to the conductive pads on the substrate during reflow (referred to as "self-centering"), the stress relief features discussed herein preferably do not interfere with this desired characteristic. Insert counterflow is best used to secure the stress relief to the substrate. "Insertion" refers to placing a fusible material (eg, solder paste) in an opening in a substrate (eg, a plated through-hole). Each alternative embodiment will be described in detail below.

[0032] Figure 1-3 An electrical connector 300 is shown. Connector 300 is a backplane header connector that preferably mates with a backplane receptacle connector (a...

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PUM

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Abstract

The invention relates to an electrical connector (300) mountable to a substrate (325). The electrical connector comprises a housing (301), a surface mount contact (307) secured to the housing and adapted to surface mount to the substrate (325), and a non-surface mount hold down (323) secured to the housing and adapted to mount to the substrate. The surface mount contact includes a fusible element, for example, a solder ball (321), a plurality of which may form a matrix array. The connector may be a ball grid array connector.

Description

[0001] This application is a divisional application of the application No. 00134879.5, filed on October 19, 2000, and entitled "Electrical Connector with Stress Relief". technical field [0002] The present invention relates to electrical connectors. In particular, the present invention relates to electrical connectors having strain relief features. Background technique [0003] Various types of electrical connectors rely on surface mount technology (SMT) to secure the connector contacts to the base substrate. SMT connectors have more advantages than earlier connectors, such as simplified manufacturing and lower costs. [0004] While providing these advantages, the use of SMT can also cause other problems. For example, one concern concerns the ability of the solder joints between the contacts and the base substrate to absorb forces such as those caused by shipping, handling, assembly, and thermal cycling. Damage to any of these links will destabilize the solder joint, adv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/74H01R24/00H01R4/02H01R12/57H01R12/70H01R12/71H01R13/58H01R13/658H01R13/6585H01R43/00H01R43/02H01R107/00H05K3/30H05K3/34
CPCH01R43/0256H05K2203/159H01R23/7063H05K3/303H01R12/716H01R13/58H01R13/6585H01R4/028H01R12/7011H01R12/707H01R23/701H01R12/57H01R12/7052H01R23/7047H01R12/7005H05K2201/10568H05K3/3421H01R23/7005H01R13/658Y02P70/50
Inventor 斯坦利·W·沃尔森约瑟夫·B·叔艾
Owner CONNECTOR SYST TECH