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Metal film forming device

A technology of metal thin film and production device, which is applied in the direction of metal material coating process, liquid chemical plating, coating, etc., can solve the problem of uneven thickness of metal thin film, and achieve good forming effect

Active Publication Date: 2009-04-29
IND TECH RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above problems, the main purpose of the present invention is to provide a metal thin film forming device to solve the problem of non-uniform thickness of the metal thin film between the substrate surface and the inner wall of the through hole when the metal thin film is formed on the substrate in the past.

Method used

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Examples

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Embodiment Construction

[0037] In order to further understand the purpose, structure, features, and functions of the present invention, the detailed description of the accompanying examples is as follows.

[0038] Such as figure 1 Shown is the metal film forming equipment established according to the present invention, which includes a frame 1, a conveying system 2 and a plurality of plating solution tanks A, B, C, D, E, F, G, H, I, and the conveying system 2 is erected above the frame 1, and is used to move the substrate to be processed in each plating bath A, B, C, D, E, F, G, H, and I. Each plating solution tank A, B, C, D, E, F, G, H, and I has a surface treatment program and a metal film forming process, wherein the surface treatment program is used to form a base film on the surface of the substrate. When the base film is formed on the surface of the substrate After that, the catalyst is coated on the surface of the substrate in a specific pattern, and then enters the metal film forming proces...

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Abstract

The invention discloses a metal film shaping device, which is characterized by the following: shaping metal film on the base with at least one through-out hole; fixing base in the one sealing cavity; making base divide sealing cavity into two parts; connecting pressure generating device and pressure control device in the sealing cavity corresponding to two sides of base; introducing and guiding depositing liquid through pressure generating device; flowing the depositing liquid on the base surface; adjusting the thickness of metal film on the base surface and in the inner wall of through-out hole completely.

Description

technical field [0001] This invention relates to metal thin film forming, and more particularly to a fluid control device. A metal thin film forming device that can form a metal thin film with different uniform thickness on the surface of the substrate and the inner wall of the through hole of the substrate. Background technique [0002] With the development of electronic devices, the manufacture of printed circuit boards is gradually moving towards high-density packaging, making the line width of the metal lines formed on the surface thinner, and the aperture diameter of the through holes on the surface for the pins of electronic components to pass through is gradually reduced. . Therefore, the thickness uniformity of the metal film formed on the printed circuit board is also required to be higher, and the defects of the metal film must also be reduced to a minimum to improve the ductility and tensile strength of the metal film and avoid insufficient strength due to thinne...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/16H05K3/00
Inventor 张杰凯郑兆凯杨明桓王仲伟陈富港曾子章李长明张志敏余丞博
Owner IND TECH RES INST