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Electroplating device

An electroplating device and electroplating tank technology, which is applied in the direction of electrodes, plating tanks, electrolysis process, etc., can solve the problems of uneven thickness of electroplating film, unreasonable structural design, etc., and achieve the effect of improving stability

Active Publication Date: 2022-03-15
东莞市点金表面处理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide an electroplating device, aiming to solve the problem that the existing electroplating device is prone to uneven plating film thickness due to unreasonable structural design

Method used

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0032] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0033] In addition, if there are descriptions involving "first", "second" and ...

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Abstract

The invention provides an electroplating device. The electroplating device comprises an electroplating cylinder, an electroplating anode, an electroplating vibration disc, an electroplating cathode and a vacuum pump, and an electroplating bath is formed in the electroplating cylinder; the electroplating anodes are arranged in the electroplating bath, the electroplating anodes comprise first anodes and second anodes, the first anodes are annularly arranged and annularly arranged on the bath wall of the electroplating bath, the multiple second anodes are arranged in the circumferential direction of the first anodes at intervals, and the second anodes are detachably connected with the first anodes; the electroplating vibration disc comprises a cylinder, the cylinder is arranged in the first anode, the second anodes are annularly arranged on the periphery of the cylinder, a containing groove is formed in the cylinder, drainage meshes are formed in the cylinder, and the containing groove and the electroplating groove are communicated through the drainage meshes; the electroplating cathode is arranged in the accommodating groove; the vacuum pump is arranged outside the electroplating cylinder, and a vacuumizing pipe is arranged on the electroplating cylinder and connected with the vacuum pump. The electroplating device disclosed by the invention can solve the problem that the thickness of an electroplated film is not uniform due to unreasonable structural design of an existing electroplating device.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating device. Background technique [0002] At present, the electroplating device is used to electroplate the product to be electroplated. Electroplating is to use the principle of electrolysis to plate a layer of metal or alloy on the surface of the product to be electroplated. Electroplating can enhance the corrosion resistance and hardness of the product to be electroplated, and improve the conductivity of the product. Lubricity and heat resistance etc. At present, due to the unreasonable structural design of the existing electroplating device, the electroplated product will have the problem of uneven thickness of the electroplating film, which affects the electroplating efficiency and electroplating quality of the product to be electroplated. Contents of the invention [0003] The main purpose of the present invention is to provide an electroplating devi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/02C25D17/00C25D17/10
CPCC25D17/02C25D17/10C25D17/00Y02P10/20
Inventor 郭健
Owner 东莞市点金表面处理有限公司