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Method for forming an image sensor having concave-shaped micro-lenses

An image sensor and microlens technology, applied in the field of image sensors, can solve the problems of larger particle pollution, difficulty in eliminating the gap between microlenses 105, etc.

Inactive Publication Date: 2009-06-10
HUA WEI SEMICONDUCTOR (SHANGAHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Convex microlenses have been found to sometimes lead to a greater potential for particle contamination due to subsequent processing steps
Moreover, it is also difficult to eliminate the gaps between the microlenses 105 due to the special process used to form the microlenses.

Method used

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  • Method for forming an image sensor having concave-shaped micro-lenses
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  • Method for forming an image sensor having concave-shaped micro-lenses

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Embodiment Construction

[0027] The present invention relates to a method for forming concave microlens structures for use in CMOS or CCD type image sensors. In the ensuing description, numerous specific details are given in order to provide a thorough understanding of the embodiments of the invention. Those skilled in the relevant art will recognize, however, that the present invention may be practiced without one or more of these specific details, or with other methods, components, etc. employed. Additionally, well-known structures or operations are not shown or described in detail to avoid obscuring aspects of various embodiments of the invention.

[0028] Throughout this patent specification, reference to "one embodiment" or "an embodiment" means that a particular feature, structure, or property described in connection with the embodiment is included in at least one embodiment of the invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places in thi...

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Abstract

A method for forming an image sensor with concave micro-lenses is disclosed. The method comprises forming a plurality of pixels in a semiconductor substrate, each pixel including a light sensitive element. Next, a base material is formed over the pixels, the base material having a first index of refraction. A micro-lens cavity is formed in the base material over each light sensitive element. The micro-lens cavity has a concave shape. Finally, a filler material is formed into the micro-lens cavities. The filler material has a second index of refraction that is higher than the first index of refraction.

Description

technical field [0001] The present invention relates to image sensors, and more particularly, to methods for fabricating image sensors having concave microlenses. Background technique [0002] Image sensors are electronic integrated circuits that can be used to generate still or video images. Solid state image sensors may be of the Charge Coupled Device (CCD) type or of the Complementary Metal Oxide Semiconductor (COMS) type. In either type of image sensor, light-focusing pixels are formed within a substrate and arranged in a two-dimensional array. Typical modern image sensors contain millions of pixels to provide high resolution images. An important part of an image sensor is the color filter and microlens structure formed on top of the pixels. Color filters, as the name suggests, effectively provide color images in conjunction with signal processing. Microlenses are used to focus incoming light onto the pixels, thereby improving the fill factor of each pixel. [0003]...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146H01L23/00G02B5/20H04N5/335H01L21/00H01L31/0216H01L31/0232
CPCH01L27/14621H01L27/14685H01L27/14627
Inventor 山本克已
Owner HUA WEI SEMICONDUCTOR (SHANGAHAI) CO LTD