Method and structure for implementing secure multichip modules for encryption applications

Abstract

A tamper-resistant integrated circuit (IC) module comprising a ceramic-based chip carrier, one or more integrated circuit chips attached to the chip carrier, and a cap attached to the chip carrier covering the one or more integrated circuit chips cover structure. A conductive grid structure is formed in the chip carrier and the cap structure, the conductive structure has a plurality of detours arranged in x-direction, y-direction and z-direction. The conductive grid structure is configured to detect attempts to hack into the IC module.

Description

technical field [0001] The present invention relates generally to integrated circuit devices and packaging methods, and more particularly to methods and structures for implementing secure multi-chip modules (MCMs) for cryptographic applications. Background technique [0002] FIPS (Federal Information Processing Standard) 140-1 is a US government standard for implementing cryptographic modules, hardware or software that encrypts and decrypts data or performs other cryptographic operations such as creating or verifying digital signatures. The FIPS 140-1 standard was created by NIST (National Institute of Standards and Technology) and specifies requirements for the proper design and implementation of products that perform encryption. [0003] In particular, FIPS 140-1 specifies requirements that cryptographic modules in security systems used to protect unclassified information in computer and telecommunications systems, including voice systems, must meet. The standard provides...

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Problems solved by technology

[0010] Unfortunately, existing Multi-Chip Modules (MCMs) that meet Level 4 security requirements are difficult to implement and cumbersome to design, including, for example, potted fragile mesh card structures

Additionally, this design provides limited capacity for desired electromagnetic (EM) shielding

Yet another difficulty comes from changing an existing cryptographic module from an organic substrate material to a ceramic-based material, as ceramic materials exhibit certain interconnect issues, such as nearest-neighbor missing ball grid arrays due to debonding of solder balls

Furthermore, a fully exfoliated structure will have a lower interconnect height, which in turn will result in a larger percentage variation between interconnect heights across the device

The dropout height of the final interconnect can also cause a short or open

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