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Test board and test method

A test board, test disk technology, applied in measuring devices, using stable tension/pressure to test material strength, measuring electrical variables, etc., can solve problems such as low efficiency, interconnect resistance value and test instability, and achieve test results Stable and efficient test results

Inactive Publication Date: 2009-07-01
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a test board and a test method to solve the shortcomings of the interconnection resistance test in the prior art that the measured resistance value cannot be directly used as the ACF interconnection resistance value and the test is unstable and inefficient

Method used

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Embodiment Construction

[0041] The core idea of ​​the present invention is: by controlling the shape and size of the test board on the PWB and the distance between the test boards, it is consistent with the slot size of the SIMM connector, and the SIMM connector is used during the test to achieve test stability and test efficiency High effect; and by controlling the length of the electrodes and the test circuit, the resistance of the test circuit is controlled, so that the resistance value obtained can be directly used as the resistance value of the ACF interconnection resistance; and by controlling the device size of the test kit, the peeling strength Testing and interconnection resistance testing can use the same test kit for testing.

[0042]In order to explain the technical solution of the present invention more clearly, the technical solution of the present invention will be described in detail below with reference to the accompanying drawings through embodiments.

[0043] The test board provided by...

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PUM

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Abstract

This invention provides one test board, which comprises flexible circuit board, rigid circuit board and single in-line memory module connector, wherein, the rigid circuit board connection electrode and test panel wire together with flexible circuit board and rigid circuit board resistance sum is equal to at least one half of the connected resistance of each opposite conductive film. This invention provides the test method to test the connected resistance testing and intensity peeling test. The invention provides test board and adopts one set of test board for peeling test and adopts the test board for resistance test to get the value as connected resistance value.

Description

Technical field [0001] The present invention relates to testing technology, in particular to a testing board and testing method. Background technique [0002] Anisotropic Conductive Adhesive Film (ACF, Anisotropic Conductive Adhesive Film) is a film made by uniformly mixing tiny metal conductive particles and epoxy glue, such as figure 1 As shown, the ACF4 is placed between the flexible circuit board 2 (FPC, Flex printed circuit) and the rigid circuit board 1 (PWB, Printed Wiring Boards) and the temperature and pressure are applied for a period of time. The conductive particles 5 are embedded in the FPC2 and PWB1. Between the electrodes 3, an electrical path is formed between the two electrodes to achieve electrical interconnection. At the same time, the epoxy resin is cured at a high temperature and bonded with the upper and lower electrodes to achieve mechanical interconnection. [0003] ACF can be applied to the interconnection of flexible circuit boards FPC and PWB. It has t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/08G01R27/08
Inventor 朱爱兰
Owner HUAWEI TECH CO LTD
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