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Producing method of micro link lug structure with stress buffer

A technology of stress buffering and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., and can solve the problems that high-end packaging chips cannot bear longitudinal and lateral stresses, etc.

Inactive Publication Date: 2009-07-15
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Based on solving the defects of the above-mentioned prior art, the present invention is a micro-connected bump structure with stress buffering and a manufacturing method. Its main purpose is to solve the problem that traditional high-end packaged chips cannot withstand longitudinal and lateral stress. The composite bump with stress buffering effect connects electronic components and circuits. The bump has the function of dispersing longitudinal and transverse stress, and can effectively protect electronic components and circuits during the packaging manufacturing process, which can achieve simple and high-quality manufacturing process. Reliable buffer structure

Method used

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  • Producing method of micro link lug structure with stress buffer
  • Producing method of micro link lug structure with stress buffer
  • Producing method of micro link lug structure with stress buffer

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Embodiment Construction

[0054] see figure 1 As shown, it is the first implementation structure diagram of the micro-connected bump with stress buffering of the present invention, wherein the bump includes a first top surface 11, and the first top surface 11 is connected to one of the substrate and the electronic component, wherein Electronic components generally refer to general chips (Chip) or other integrated circuits (IC) using surface bonding technology (SMT). A second top surface 12, the second top surface 12 is connected to one of the substrate and the electronic component, of course, the electronic component also refers to a chip or an integrated circuit; a support body 13 is connected to the first top surface 11 and the second top surface Between the surfaces 12, and the surface area of ​​the two ends of the support body 13 is not larger than the first top surface 11 and the second top surface 12, and this embodiment is a columnar body. The connection structure of the first top surface 11, t...

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Abstract

The lug structure includes following parts: a first top surface connected to one of base plate and electronic module; a second top surface connected to one of base plate and electronic module; a support body connected between the first top surface and the second top surface, and surface areas at two ends of the support body are not larger than surfaces of the first top surface and the second top surface; being setup outside the support body, the buffer layer provides functions for absorbing stress and buffered effect.

Description

technical field [0001] The invention relates to a method for manufacturing a micro-connected bump structure with stress buffering, in particular to a method for solving the problem that traditional high-end packaging chips cannot bear longitudinal and lateral stresses, and using a composite bump with a stress buffering effect for electronic components The connection between the bump and the circuit, the bump has the function of dispersing the longitudinal and transverse stress, can effectively protect the electronic components and the circuit during the manufacturing process of the package, and can achieve a buffer structure with simple manufacturing process and high reliability. Background technique [0002] The rapid development of the semiconductor industry enables all electronic products to be designed into light, thin, short and small structures, because the IC components of electronic products are designed with high pin count, high transmission speed and multi-functiona...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/485H01L23/498H01L21/60H01L21/48H01L21/28
CPCH01L2924/0002
Inventor 许永昱廖锡卿谭瑞敏郑智元
Owner IND TECH RES INST