Component mounting apparatus and substrate transfer method

Abstract

The invention provides a component mounting device and a substrate conveying method. A substrate transfer device (24A) of a component mounting device includes linear guides (78A, 78B) and substrate holding sliders (79A, 79B). The linear guides (78A, 78B) extend along the transfer direction (C) from the first substrate transfer position (P1) to the second substrate transfer position (P2), and are spaced apart in a direction perpendicular to the transfer direction (C). The gaps (G1) are opposed to each other. The substrate holding sliders (79A, 79B) are movable along the linear motion guides (78A, 78B), are opposed to each other with a gap (G2) in the direction perpendicular to the conveying direction (C), and act on the substrate ( 12) The suction force of the underlying vacuum source is releasably maintained. The substrate holding sliders (79A, 79B) reciprocate between the first and second substrate transfer positions (P1, P2) along the conveying direction of the substrate (12) by an X-axis driving mechanism (87).

Description

technical field [0001] The present invention relates to a substrate conveying device and method for conveying substrates including glass substrates such as liquid crystal display substrates (LCD substrates) and plasma display substrates (PDP substrates), and for mounting such substrates including IC chips, various A component mounting device for components including electronic components such as semiconductor devices. Background technique [0002] Patent Document 1 discloses an example of a conventional component mounting device. first refer to Figure 20 , and reference numeral 1 is a substrate mounting table for holding a substrate 2 . Adsorption holes (not shown) are formed in the substrate stage 1 as a rigid body, and the lower surface of the substrate 2 is held on the substrate stage 1 by the suction force acting on the adsorption holes. In addition, reference numeral 3 denotes a substrate transfer device that transfers the substrate 2 and transfers the substrate 2 to...

AI Technical Summary

Problems solved by technology

For example, the misalignment of the substrate at the time of handover becomes a cause of a decrease in the accuracy of the mounting position of the component at the time of temporary crimping.

In addition, if the substrate is warped, leakage occurs at the time of transfer, so the time required for the adsorption and retention force to rise to a sufficient value becomes longer, which becomes a pipe loss.

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