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Novel polyimide copolymer and metal laminate using the same

A polyimide and copolymer technology, which is applied in the field of polyimide copolymer and its metal laminates, can solve the problems of reducing the coefficient of linear expansion and heating shrinkage and resistance to curling.

Inactive Publication Date: 2009-07-29
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The polyimide copolymer used here is isopropylidene bis(4-phenyleneoxy-4-phthalic acid) dianhydride and 6-amino-2-(p-aminophenyl)benzimidazole The polyimide copolymer obtained by polycondensation of the above components has high adhesive strength in itself, and even if it is bonded to the metal foil without an adhesive layer, a metal foil that meets the peel strength can be obtained. Laminates, and welding heat resistance is also good, but not for the purpose of reducing the coefficient of linear expansion and heat shrinkage, and improving curl resistance

Method used

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  • Novel polyimide copolymer and metal laminate using the same
  • Novel polyimide copolymer and metal laminate using the same
  • Novel polyimide copolymer and metal laminate using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Under a nitrogen replacement atmosphere, in a four-necked flask with a capacity of 10 L equipped with a stirring device, charge 520.1 g (1.0 mol) of (A) isopropylidene bis(4-phenyleneoxy-4-phthalic di Formic acid) dianhydride and 294.0g (1.0 moles) (B) 3,3',4,4'-biphenyltetracarboxylic dianhydride dissolved in the solution of 7150ml N-methyl-2-pyrrolidone, while keeping 448.0 g (2.0 moles) of (C) 6-amino-2- (p-aminophenyl) benzimidazole was charged at a temperature exceeding 60° C. and stirred at room temperature for 3 hours to obtain 8,245 g of varnish-like polyimide. A bulk copolymer solution (viscosity at 25° C. of 7900 cps, solid content concentration of 15% by weight).

[0043] On the roughened surface of a roll-shaped electrolytic copper foil (manufactured by Furukawa Electric; thickness 10 μm), apply the above-mentioned polyimide precursor copolymer solution to a thickness of 18 μm using a reverse roll coater, and dry it with hot air at 120°C The solvent was con...

Embodiment 2

[0045] In Example 1, the amount of component (A) was changed to 260.0g (0.5 mol), the amount of component (B) was changed to 441.0g (1.5 mol), and the amount of N-methyl 2-pyrrolidone was changed to 6510ml to obtain 7572g Varnish-like polyimide precursor copolymer solution (8200 cps, 15% by weight). As in Example 1, the polyimide-laminated copper foil was produced using the polyimide precursor copolymer solution.

Embodiment 3

[0047] In Example 2, the amount of N-methyl-2-pyrrolidone was changed to 6520ml, the amount of (C) component was changed to 403.2g (1.8 moles), and (D 1 ) 40.0 g (0.2 mol) of bis (4-aminophenyl) ether to obtain 7470 g of varnish-like polyimide precursor copolymer solution (5500 cps, 15% (weight)). As in Example 1, the polyimide-laminated copper foil was produced using the polyimide precursor copolymer solution.

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Abstract

A novel polyimide copolymer composed of (A) isopropylidene bis(4- Two kinds of tetracarboxylic dianhydrides composed of phenyleneoxy-4-phthalic acid dianhydride and (B) 3,3',4,4'-biphenyltetracarboxylic dianhydride and (C) A diamine consisting of 6-amino-2-(p-aminophenyl) benzimidazole or the diamine mixed with (D) bis(4-aminophenyl) ether (D1) and phenylenediamine (D2) A copolymer of at least one composition of two or three diamines.

Description

[0001] This application is a divisional application of the following application: Application No.: 038194376 (PCT / JP2003 / 008484); Application Date: July 3, 2003; Invention Title: "Novel polyimide copolymer and its metal laminate" . technical field [0002] This invention relates to polyimide copolymers and metal laminates thereof. Specifically, it relates to a polyimide copolymer suitable as a film for a flexible printed wiring board and a metal laminate thereof. Background technique [0003] Conventionally, substrates such as flexible printed wiring boards have been manufactured by laminating metal foils and aramid films with adhesives such as epoxy resins and polyurethane resins. However, these flexible printed wiring boards manufactured with adhesives have disadvantages, that is, it is often seen that hysteresis in subsequent thermal bonding, peeling of the adhesive when high heat is applied in the soldering process, or scratches in the drilling process are often seen du...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10B32B15/08B32B27/34H05K1/03
Inventor 左敏林正添
Owner NIPPON MEKTRON LTD