Novel polyimide copolymer and metal laminate using the same
A polyimide and copolymer technology, which is applied in the field of polyimide copolymer and its metal laminates, can solve the problems of reducing the coefficient of linear expansion and heating shrinkage and resistance to curling.
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Embodiment 1
[0042] Under a nitrogen replacement atmosphere, in a four-necked flask with a capacity of 10 L equipped with a stirring device, charge 520.1 g (1.0 mol) of (A) isopropylidene bis(4-phenyleneoxy-4-phthalic di Formic acid) dianhydride and 294.0g (1.0 moles) (B) 3,3',4,4'-biphenyltetracarboxylic dianhydride dissolved in the solution of 7150ml N-methyl-2-pyrrolidone, while keeping 448.0 g (2.0 moles) of (C) 6-amino-2- (p-aminophenyl) benzimidazole was charged at a temperature exceeding 60° C. and stirred at room temperature for 3 hours to obtain 8,245 g of varnish-like polyimide. A bulk copolymer solution (viscosity at 25° C. of 7900 cps, solid content concentration of 15% by weight).
[0043] On the roughened surface of a roll-shaped electrolytic copper foil (manufactured by Furukawa Electric; thickness 10 μm), apply the above-mentioned polyimide precursor copolymer solution to a thickness of 18 μm using a reverse roll coater, and dry it with hot air at 120°C The solvent was con...
Embodiment 2
[0045] In Example 1, the amount of component (A) was changed to 260.0g (0.5 mol), the amount of component (B) was changed to 441.0g (1.5 mol), and the amount of N-methyl 2-pyrrolidone was changed to 6510ml to obtain 7572g Varnish-like polyimide precursor copolymer solution (8200 cps, 15% by weight). As in Example 1, the polyimide-laminated copper foil was produced using the polyimide precursor copolymer solution.
Embodiment 3
[0047] In Example 2, the amount of N-methyl-2-pyrrolidone was changed to 6520ml, the amount of (C) component was changed to 403.2g (1.8 moles), and (D 1 ) 40.0 g (0.2 mol) of bis (4-aminophenyl) ether to obtain 7470 g of varnish-like polyimide precursor copolymer solution (5500 cps, 15% (weight)). As in Example 1, the polyimide-laminated copper foil was produced using the polyimide precursor copolymer solution.
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