Method for bonding heating plate for elevated temperature substrate web and heating plate
A bonding method and heating plate technology, which are applied in the fields of ohmic resistance heating, electric heating devices, welding equipment, etc., can solve the problems of poor flow, increased production cost, poor pass rate, etc., and achieve good tightness, small temperature gradient, The effect of the best conduction effect
Active Publication Date: 2009-08-05
METAL INDS RES & DEV CENT
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Problems solved by technology
[0008] In view of the above-mentioned problems in the prior art, the present invention provides a heating plate bonding method and a heating plate for raising the temperature of the base material, which are used to solve the defects of poor flow and air holes formed by the casting manufacturing process, which affect the The thermal conductivity distribution and conduction efficiency cannot be used in a vacuum environment. At the same time, it also overcomes the shortcomings of forging and pressing or general welding manufacturing processes, which lead to increased manufacturing complexity or difficulty for large-sized heating plates, and poor yields. Disadvantages with increased overall production costs
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[0049] see figure 2 , the present invention is a method for bonding a heating plate for raising the temperature of a substrate. The method for bonding the heating plate for raising the temperature of the substrate S1 includes the following steps: providing a carrying guide plate (step S10), providing a heating wire (step S20 ), provide a heating guide plate (step S30), carry out the operation of using the friction stir welding manufacturing process to join the bearing guide plate and the heating guide plate (step S40), provide a wire guide tube (step S50), perform using the friction stir welding manufacturing process to join the wire The guide tube is operated on the load guide plate (step S60 ) and reinforced by the friction stir welding manufacturing process (step S70 ).
[0050] see again figure 2 and image 3 , a method for joining a heating plate used to raise the temperature of a substrate in the present invention, the method S1 for joining a heating plate used to ra...
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The invention discloses a method for joining a heating plate used to raise the temperature of a base material and the heating plate. The method includes the steps of providing a carrying guide plate, providing a heating wire, and providing a heating guide plate. Grooves are respectively provided on the two guide plates to form a container. There is a space for the heating wires to be accommodated, and there are also joint surfaces for mutual jointing, and the operation steps of joining the carrying guide plate and the heating guide plate through the friction stir welding manufacturing process are carried out, so that the two guide plates are joined into one, and a guide tube for the wire is provided. The heating wire is extended and accommodated, and the operation step of joining the wire guide tube to the load guide plate is performed by using the friction stir welding manufacturing process.
Description
technical field [0001] The invention relates to a heating plate bonding method and a heating plate, in particular to a heating plate bonding method and a heating plate for raising the temperature of a base material, which can improve heat conduction efficiency, maintain a minimum temperature gradient, and achieve a uniform surface temperature of the heating plate. Background technique [0002] The recent rapid progress of multimedia technology is mostly due to the rapid progress of semiconductor components or man-machine display devices. As far as the display is concerned, the cold cathode ray tube (Cathode Ray Tube, CRT) has been monopolizing the display market in recent years because of its excellent display quality and economical efficiency. However, for the environment in which individuals operate display devices on the table or from the viewpoint of environmental protection, if the trend of energy saving can be predicted, there are still many problems in the space utili...
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IPC IPC(8): B23K20/12H05B3/30B23K103/08
Inventor 陈冠佑吴隆佃
Owner METAL INDS RES & DEV CENT