Packaging structure

A packaging structure, packaging colloid technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as difficult coating amount
CN100530614CActive Publication Date: 2009-08-19ADVANCED SEMICON ENG INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
ADVANCED SEMICON ENG INC
Publication Date
2009-08-19

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Abstract

The present invention provides a packaging structure, which includes a first substrate and a second substrate, wherein the upper surface of the first substrate has a predetermined area, and a first sealing ring with a first height is located on the upper surface of the first substrate, and arranged on the periphery of the above-mentioned predetermined area, and connected to the lower surface of the second substrate, a second sealing ring with a second height smaller than the first height is located on the upper surface of the first substrate, and is arranged on the first sealing ring The periphery, and a channel is surrounded by the first sealing ring, and an encapsulant is located in the channel. The encapsulation structure of the present invention can effectively provide adhesion and airtightness, reduce the usage of encapsulation colloid, and avoid contamination of the component area.
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Description

【Technical field】

[0001] The present invention relates to a packaging structure, and in particular to a packaging structure that can increase adhesion and airtightness, effectively reduce the amount of packaging glue used, and avoid contamination of the component area. 【Background technique】

[0002] Since electronic components such as semiconductor components, micro-electromechanical components (MEMS), or optoelectronic components have tiny and fine circuits and structures, in order to avoid dust, acid and alkali substances, moisture and oxygen from polluting or corroding electronic components, thereby affecting their reliability And life, the process needs to use packaging technology to provide the above-mentioned electronic components with functions such as power distribution, signal distribution, heat dissipation, protection and support.

[0003] Most packaging technologies separate the wafer into independent chips and then complete the packaging process, while wafer-lev...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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