Unlock instant, AI-driven research and patent intelligence for your innovation.

Input/output interface of an integrated circuit device

A technology of integrated circuits and equipment, applied in the field of input/output interfaces, can solve the problems of increased power consumption, noise, large equipment area, occupation, etc.

Inactive Publication Date: 2009-09-16
SAMSUNG ELECTRONICS CO LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, any increase in the number of bits of the data transfer rate of the I / O interface will result in having to additionally equip the device with an equal number of data pins
As previously suggested, any increase in the number of data pins disadvantageously occupies a larger device area, and also increases power consumption and power-related noise

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Input/output interface of an integrated circuit device
  • Input/output interface of an integrated circuit device
  • Input/output interface of an integrated circuit device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The invention will now be described with reference to several non-limiting preferred embodiments.

[0030] Figure 4 is a block diagram of an input / output (I / O) interface according to one embodiment of the present invention. The I / O interface 200 of this embodiment includes a converter 210, which respectively receives M A base level input signals (DATA1, DATA2, DATA3) from M first terminals, and encodes each level input signal indicated by the A M The values ​​are the different K base values ​​represented by the N K base level output signals. Then, the converter 210 respectively outputs the N K-based output signals to the N second terminals ( DQ1 , DQ2 ). Here, M>N, and K>A>1, and all of M, N, K, and A are positive integers.

[0031] exist Figure 4 In the example of , M=3 and A=2, therefore, the data DATA1 , DATA2 and DATA3 are 2-base level (binary) signals, that is, received at the three input terminals of the converter 210 respectively. Furthermore, in this exa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

PROBLEM TO BE SOLVED: To provide an integrated circuit in which the number of bits in data inputted / outputted through one pad can be increased, and an input / output interface method of the integrated circuit. ŽSOLUTION: The integrated circuit includes M first terminals and N second terminals (M and N are positive integers of M>N>1). Besides, the circuit is further includes a converter for receiving M input signals including A levels from the M first terminals and for encoding each of A<SP>M< / SP>values represented with the M input signals including the A levels into a value represented with N output signals including K levels. In such a case, A and K are positive integers of K>A>1. Besides, the converter outputs the N output signals having the K levels to each of the N second terminals. Ž

Description

technical field [0001] The present invention relates generally to integrated circuit devices, and more particularly, the present invention relates to an input / output (I / O) interface of an integrated circuit device. Background technique [0002] It is generally desirable to increase data transfer bandwidth over an input / output (I / O) interface of an integrated circuit (IC) device. Unfortunately, however, the increase in transmission bandwidth is accompanied by an increase in the number of data pins of the IC device. The many data pins disadvantageously occupy a large device area and also increase power consumption and power-related noise. [0003] figure 1 is a block diagram of a conventional memory circuit. Address signals ADDR1-ADDRi are temporarily stored by an address buffer 10, and a clock signal CLK and external command signals / CS, / RAS, / CAS and / WE are applied to a command decoder 20. On timing selection of the clock signal CLK, the command decoder decodes the ext...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F13/00G11C7/10H03M7/00G11C11/417G11C11/401G11C11/4093H01L21/822H01L27/04H03K19/0175H03K19/20
CPCH03K19/0175H01L21/822G11C11/401G11C11/417H03K19/20G11C7/10G11C11/4093H01L27/04G11C7/1006
Inventor 张星珍
Owner SAMSUNG ELECTRONICS CO LTD