Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Integral cooling system and LED illumination device with the same

A heat dissipation system, an integrated technology, applied in lighting devices, cooling/heating devices for lighting devices, lighting and heating equipment, etc. Efficiency, the effect of reducing production costs

Inactive Publication Date: 2009-10-14
SHENZHEN SED IND
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing devices that require heat dissipation, such as computers or lighting lamps; during the operation of computers, some core components will generate a large amount of heat. It is very harmful, making the computer system unstable, shortening the service life, and may even cause parts to burn out, so it is necessary to have a good heat dissipation system; lighting lamps, especially lighting lamps used in tunnels, no matter in Bright day or dark night, no matter what kind of weather, the lighting in the tunnel is required to meet the national road tunnel lighting standards to ensure driving safety in the tunnel. The continuous work of this kind of lighting leads to a large number of Heat, the heat directly affects the service life of the lamp, so the lighting device also needs to have a good heat dissipation system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Integral cooling system and LED illumination device with the same
  • Integral cooling system and LED illumination device with the same
  • Integral cooling system and LED illumination device with the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Such as figure 1 shown. The present invention provides an integral heat dissipation system, which includes a heat conduction mechanism 1 and a heat dissipation mechanism (including 2). There is a heat pipe 12 with a heat absorbing portion 121 and a condensing portion 122, the bottom plate 11 has a mounting surface for installing a heat source and other heat dissipation surfaces for heat dissipation; the heat dissipation mechanism is a heat dissipation casing 2, and the heat dissipation casing 2 can be formed by Extruded pure aluminum; contact heat transfer between the heat dissipation surface of the bottom plate 11 , the condensation part 122 of the heat pipe 12 and the inner wall of the heat dissipation housing 2 . The heat absorbing portion 121 of the heat pipe 12 is located near the installation surface of the bottom plate, and the condensation portion 122 of the heat pipe 12 is located on a side adjacent to the installation surface of the bottom plate 11 .

[0021...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides an integral heat dissipation system, which includes a heat conduction mechanism and a heat dissipation mechanism. The heat conduction mechanism includes a bottom plate and a heat pipe; the heat dissipation mechanism is a heat dissipation shell; Contact heat transfer with the inner wall of the heat dissipation housing; the heat absorbing part of the heat pipe is located near the installation surface of the bottom plate, and the condensation part of the heat pipe is located adjacent to the installation surface of the bottom plate On the side; the heat conduction mechanism includes a plurality of heat pipes, the heat conduction mechanism also includes a heat pipe press plate, and the heat pipe press plate is arranged at a position near the bend of the heat pipe; the condensing part of the arranged heat pipes is fixed with a side plate to fix. The beneficial effects are: the integrated heat dissipation system with the base plate with high heat capacity, the heat pipe with high thermal conductivity and the integrated heat dissipation shell improves the efficiency of heat dissipation; especially the integrated heat dissipation shell ensures the quality of heat dissipation while reducing the heat dissipation of the system. volume and lower production costs.

Description

【Technical field】 [0001] The invention relates to the technical field of heat dissipation, in particular to an integral heat dissipation system and an LED lighting device with the integral heat dissipation system. 【Background technique】 [0002] The device generally generates heat during operation, and the heat needs to be removed in time to ensure that each component in the device works within a normal temperature range. Existing devices that require heat dissipation, such as computers or lighting lamps; during the operation of computers, some core components will generate a large amount of heat. It is very harmful, making the computer system unstable, shortening the service life, and may even cause parts to burn out, so it is necessary to have a good heat dissipation system; lighting lamps, especially lighting lamps used in tunnels, no matter in Bright day or dark night, no matter what kind of weather, the lighting in the tunnel is required to meet the national road tunne...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): F21V29/00H01L23/36F21Y101/02F21V29/51F21V29/76F21Y115/10
Inventor 李志强常瑞群刘旭光
Owner SHENZHEN SED IND
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products