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Temperature sensor imbedding material

A temperature sensor and potting compound technology, applied in thermometers, thermometer parts, instruments, etc., can solve problems such as poor insulation, low high and low temperature impact resistance, and poor water resistance of temperature sensors, so as to achieve the effect of no deterioration in performance

Inactive Publication Date: 2009-11-11
常州市科文传感器材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is that common epoxy resin potting compound has poor insulation, and the temperature sensor made of common epoxy resin potting compound has poor water resistance and low high and low temperature impact resistance.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0014] The embodiment of the preferred formulation of this temperature sensor potting compound (the following parts are mass parts):

[0015] Bisphenol A epoxy resin 40 parts Dainippon Ink Chemical Co., Ltd. (DIC)

[0016] Thinner 5 parts Taiwan Nanya

[0017] 400 mesh silica fume 30 parts Huzhou Universal

[0018] 1000 mesh micro silica fume 20 parts Huzhou Universal

[0019] Nano-scale micro-silica fume 6 parts Huzhou universal

[0020] Aluminum hydroxide powder 15 parts Shandong Aluminum

[0021] Nitrile rubber 10 parts American merald

[0022] NL-1 modified amine curing agent 23 parts Changzhou Kewen

[0023] Prepared as potting compound 1#

example 2

[0025] The embodiment of this temperature sensor potting compound (the following parts are mass parts):

[0026] Bisphenol A epoxy resin 30 parts Dainippon Ink Chemical Co., Ltd. (DIC)

[0027] Thinner 3 parts Taiwan Nanya

[0028] 400 mesh silica fume 20 parts Huzhou Universal

[0029] 1000 mesh micro silica fume 20 parts Huzhou Universal

[0030] Nano-scale micro-silica fume 5 parts Huzhou Wanneng

[0031] Aluminum hydroxide powder 10 parts Shandong Aluminum

[0032] Nitrile rubber 5 parts American merald

[0033] NL-1 modified amine curing agent 20 parts Changzhou Kewen

[0034] Prepared as potting compound 2#

example 3

[0036] The embodiment of this temperature sensor potting compound (the following parts are mass parts):

[0037] Bisphenol A epoxy resin 60 parts Dainippon Ink Chemical Co., Ltd. (DIC)

[0038] Thinner 15 parts Taiwan South Asia

[0039] 40 parts of 400 mesh silica fume Huzhou Universal

[0040] 1000 mesh silica fume 40 parts Huzhou universal

[0041] 10 parts of nano-scale micro-silica fume Huzhou Wanneng

[0042] Aluminum hydroxide powder 20 parts Shandong Aluminum

[0043] Nitrile rubber 20 parts American merald

[0044] NL-1 modified amine curing agent 25 parts Changzhou Kewen

[0045] Prepared as potting compound 3#

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PUM

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Abstract

The present invention aims at the problems of poor insulation and low high and low temperature impact resistance of existing ordinary epoxy resin potting materials. The potting compound made of curing agent in a certain proportion is a kind of potting effect suitable for drastic changes in temperature and environment.

Description

technical field [0001] The invention relates to the technical field of potting and sealing of electronic products, in particular to a temperature sensor potting compound resistant to high and low temperature impact. Background technique [0002] For a long time, epoxy potting materials for temperature sensors at home and abroad have been imported from Japan and the United States. Domestic temperature sensor companies have used epoxy resin potting materials for capacitors to fix and seal temperature sensors, and there is no professional environment for temperature sensors. Oxygen resin potting compound, the disadvantage of epoxy resin potting compound for capacitors is that the insulation of epoxy resin itself is poor, and the adhesion between epoxy resin and metal shell is poor. The case is detached and the temperature sensor is degraded. Contents of the invention [0003] The technical problem to be solved by the present invention is that the ordinary epoxy resin potting...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K3/10G01K1/00
Inventor 倪伟文
Owner 常州市科文传感器材料有限公司
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