Device for measuring thermal conductive property

Abstract

The provided detection device for heat conduction property comprises: a heating part and cooling part every with a support plane to form a gap, a microscope to amplify the gap, and a DC. This invention can detect the heat interface material width and its thermal conductivity.

Description

【Technical field】 [0001] The invention relates to a thermal conductivity measurement device, in particular to a thermal conductivity measurement device of a thermal interface material. 【Background technique】 [0002] In recent years, with the rapid development of the integration process of semiconductor devices, the degree of integration of semiconductor devices has become higher and higher. However, the volume of devices has become smaller and smaller, and their demand for heat dissipation has become higher and higher. Important issues. In order to meet this need, various heat dissipation methods such as fan heat dissipation, water-cooled auxiliary heat dissipation, and heat pipe heat dissipation are widely used, and a certain heat dissipation effect has been achieved. However, due to the uneven contact interface between the heat sink and the heat source, the mutual contact area is generally less than 2 %, there is no ideal contact interface, which fundamentally affects th...

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Problems solved by technology

However, since the thickness of thermal interface materials is generally very small, it is difficult to accurately measure its thickness, so it is difficult to accurately measure the thermal conductivity of thermal interface materials

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